Senior IC Packaging Engineer — RF & mmWave SI/PI

Blue Origin LLC; San Diego (CA); On-site; USD 230,398 - 322,556; Full time

Benefits offered by this job

Medical insurance and other benefits

401(k) with company match

Education Support Program

Stock Options

Paid Time Off

Job summary

Blue Origin LLC is seeking a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RF/mixed-signal and mmWave IC packaging. You will perform HFSS-based analysis across package interfaces and design power delivery networks to meet stringent PI targets.

You will collaborate with RFIC, mmWave, ASIC, and SoC teams, leading the SI portion of package delivery and producing documentation for reviews. A technical lead role with cross-functional impact.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 7+ years of industry experience in IC packaging or related field.
• Experience delivering IC packaging in production environments.
• Experience with 2.5D/3D EM simulators such as HFSS, EMX, Momentum.
• Experience RF modeling, RF impedance, and high-speed routing.
• US citizenship, permanent residency, or eligible refugee status.

Responsibilities

• Own signal and power integrity for RF/Mixed-Signal and mmWave IC packaging designs.
• Perform SI analysis and HFSS simulations for high‑speed signals across package interfaces.
• Design and analyze power delivery networks using HFSS to meet PI targets.
• Model and characterize RF/mmWave packaging with HFSS tools.
• Collaborate with RFIC, mmWave, ASIC, Package Layout, and SoC teams on package requirements.
• Lead the SI portion of package delivery as a technical lead.
• Create documentation and specifications and support design reviews.

Skills

RF/Mixed-Signal

mmWave

Signal Integrity

Power Integrity

HFSS

2.5D/3D EM simulators

RF impedance

High-speed routing

Education

Bachelor's degree in Electrical Engineering

Advanced degree (MS/PhD) in Electrical Engineering

Tools

HFSS

EMX

Momentum

Cadence Allegro

Job description

Blue Origin LLC is seeking a Senior IC Packaging: Signal and Power Integrity Engineer to own SI/PI for RF/mixed-signal and mmWave IC packaging. You will perform HFSS-based analysis across package interfaces and design power delivery networks to meet stringent PI targets.

You will collaborate with RFIC, mmWave, ASIC, and SoC teams, leading the SI portion of package delivery and producing documentation for reviews. A technical lead role with cross-functional impact.