Senior Metal AM Process Engineer (Copper on Silicon)

ChipAdd Corp.; City of Binghamton (NY); On-site; USD 115,000 - 140,000; Full time

Benefits offered by this job

Equity

Health insurance

Paid time off

Competitive base salary

Job summary

CHIPADD, based in Binghamton, NY, is seeking a senior process engineer / materials scientist to advance copper cooling features printed directly onto silicon using metal additive manufacturing.

You will own the end-to-end process, run DOEs, qualify new materials, write SOPs and collaborate with the thermal design team to optimize density, porosity, surface finish and manufacturability.

Qualifications

• MS or PhD in Mechanical or Manufacturing Engineering required or equivalent.
• 5–7 years hands-on metal AM process development experience.
• Experience setting AM parameters for density, porosity and surface finish.
• Experience qualifying new materials via tests and coupons.

Responsibilities

• Develop, tune and lock down metal AM process parameters for printing copper cooling features onto silicon.
• Own end-to-end process: surface prep, interfaces, build, post-processing and inspection.
• Plan and run DOEs to map process windows and correlate with density, porosity and adhesion.
• Characterize parts with microscopy, profilometry, CT and mechanical testing.
• Write SOPs, work instructions and PFMEA to ensure repeatable builds.
• Evaluate vendors, tools and post-processing equipment against requirements.

Skills

Metal AM process development

DOE design of experiments

Statistical mindset

Thermal management

Materials evaluation

Process optimization

Education

MS in Mechanical or Manufacturing Engineering

PhD in Mechanical or Manufacturing Engineering

Tools

JMP

Minitab

Python

Ansys

COMSOL

Job description

CHIPADD, based in Binghamton, NY, is seeking a senior process engineer / materials scientist to advance copper cooling features printed directly onto silicon using metal additive manufacturing.

You will own the end-to-end process, run DOEs, qualify new materials, write SOPs and collaborate with the thermal design team to optimize density, porosity, surface finish and manufacturability.