Senior Reflow & Attach Process Engineer — Equity & Scale

ChipAdd Corp.; City of Binghamton (NY); On-site; USD 125,000 - 155,000; Full time

Job summary

ChipAdd Corp., based in Binghamton, NY, is seeking a Senior Reflow and Attach Process Engineer to design and implement the attach process for bonding cooling technology to silicon die, packages, and boards. This full-time role emphasizes production-scale reliability and precision in reflow and attachment processes.

As a senior member of the team, you will own end-to-end process development, drive scale-up, and collaborate with cross-functional groups to ensure robust manufacturing.

Responsibilities

• Develop the attach process for bonding CHIPADD’s cooling technology to silicon die, packages and boards

Job description

ChipAdd Corp., based in Binghamton, NY, is seeking a Senior Reflow and Attach Process Engineer to design and implement the attach process for bonding cooling technology to silicon die, packages, and boards. This full-time role emphasizes production-scale reliability and precision in reflow and attachment processes.

As a senior member of the team, you will own end-to-end process development, drive scale-up, and collaborate with cross-functional groups to ensure robust manufacturing.