Senior Thermal Engineer – Liquid Cooling

ChipAdd Corp.

City of Binghamton (NY)

Sur place

USD 120 000 - 155 000

Plein temps

Il y a 3 jours
Soyez parmi les premiers à postuler

Obtenez une réponse de cet employeur

Votre CV et votre lettre de motivation, adaptés exactement à ce que l’employeur recherche.

Passez les filtres ATS

Avantages offerts par ce poste

Equity
Medical insurance
Dental insurance
Vision insurance
Paid time off

Résumé du poste

CHIPADD Corp. in Binghamton, NY is seeking a Senior Thermal Engineer to lead liquid cooling design for advanced electronics. You will build CFD models, optimize cooling geometries, and develop single‑ and two‑phase cooling solutions for high heat flux devices.

Expect hands‑on test loops, prototyping collaboration, and data‑driven validation. The role requires 5–7 years of relevant experience, an MS/PhD in Mechanical Engineering, and expertise with industry CFD tools.

Qualifications

  • MS or PhD in Mechanical Engineering with emphasis on heat transfer or thermal-fluid sciences.
  • 5–7 years of hands-on electronics cooling design experience.
  • Expert-level thermal and fluid modeling and simulation skills.
  • Experience designing single-phase liquid cooling and strong two-phase knowledge.
  • Ability to correlate simulations with test data and present results.

Responsabilités

  • Build and run thermal and fluid models from CFD to reduced-order models.
  • Optimize cooling geometry for thermal resistance and pressure drop.
  • Design single- and two-phase cooling solutions and predict critical heat flux.
  • Evaluate fluids for heat transfer, pumping power, and reliability.
  • Design, build and run liquid cooling flow loops and test stands.
  • Plan experiments and perform uncertainty analysis on measurements.
  • Collaborate with prototyping and test teams to convert designs into hardware.
  • Translate power and hotspot requirements into cooling designs.
  • Correlate simulations with test data and present results to customers.

Connaissances

Thermal modeling
CFD
Fluid design
Two‑phase cooling
Experimental testing
Data‑driven analysis

Formation

MS or PhD in Mechanical Engineering

Outils

Ansys Fluent
Icepak
SOLIDWORK Flow
COMSOL
Simcenter STAR-CCM+
FloTHERM

Description du poste

Senior Thermal Engineer – Liquid Cooling
  • Employment type: Full-time
  • Seniority: Senior
  • Salary range: $120,000 – $155,000 per year + equity

Hot spots are headed for 500 W/cm². You'll design the cooling that wins that fight, then prove it on the flow loop.

About CHIPADD

CHIPADD is based in Binghamton, NY, close to the original birthplace of IBM, and we have leadership based in Silicon Valley as well. Our culture runs on curiosity, execution and a deep commitment to the mission.

What You'll Do
  • Build and run thermal and fluid models of chip-integrated cooling, from detailed CFD and conjugate heat transfer models to fast reduced-order models, using tools such as Ansys Fluent or Icepak, SOLIDWORK Flow, COMSOL, Simcenter STAR-CCM+ or FloTHERM
  • Optimize cooling geometry for thermal resistance, pressure drop, flow distribution and manufacturability
  • Design single-phase and two-phase cooling solutions, including flow boiling and pumped two-phase, and predict critical heat flux, dryout, flow instabilities and two-phase pressure drop
  • Evaluate fluids, including water and glycol mixtures, dielectric fluids and refrigerants, for heat transfer, pumping power, material compatibility, reliability, safety, environmental impact and cost
  • Design, build and run liquid cooling flow loops and thermal test stands, including pumps, chillers, heat exchangers, flow meters, pressure transducers, thermocouples and RTDs
  • Plan and run experiments with thermal test vehicles and heater dies to measure thermal resistance, junction temperature, pressure drop and flow, with rigorous uncertainty analysis
  • Use our in-house prototyping equipment, and work closely with our prototyping, additive manufacturing and test teams, to turn designs into test hardware fast
  • Translate semiconductor and data center requirements (power, hot-spot heat flux, coolant supply temperature, flow rate and pressure-drop budget) into cooling designs and specifications
  • Correlate simulations with test data so our models become a trusted design tool, and present results to customers and partners
What You Bring
  • MS or PhD in Mechanical Engineering or a related field, with a focus on heat transfer or thermal-fluid sciences
  • 5–7 years of hands‑on experience in thermal and fluid design of electronics cooling
  • Expert-level thermal and fluid modeling and simulation skills
  • Proven experience designing single-phase liquid cooling, plus strong working knowledge of two‑phase cooling (flow boiling, critical heat flux and two‑phase pressure drop)
  • Deep understanding of the trade‑offs between cooling fluids: thermophysical properties, pumping power, material compatibility, corrosion, reliability and environmental impact
  • Expert in liquid cooling flow loops: designing, building, instrumenting and running them
  • Expert in thermal and flow measurement techniques (thermocouples, RTDs, IR thermography, thermal test vehicles, flow and pressure measurement) and measurement uncertainty analysis
  • Familiarity with semiconductor package thermal management and data center liquid cooling (direct‑to‑chip cold plates, coolant distribution units and OCP specifications)
  • Track record of correlating simulations with test data and presenting results clearly to customers and leadership
Bonus Points
  • Experience with thermal test vehicles or cold plates for CPUs, GPUs or AI accelerators
  • Experience with pumped two‑phase, immersion or jet impingement cooling
  • Experience with microchannel, additively manufactured or porous metal heat sinks and cold plates
  • Scripting for simulation automation, design optimization and data analysis (Python, MATLAB or similar)
  • Publications or patents in electronics cooling or two‑phase heat transfer
Who Thrives Here

Hungry. You want the hard problem, and you'd rather ship a working prototype on Friday than a perfect slide deck next month.

Humble. You let the data win the argument, especially when it disagrees with you.

Smart. You learn fast, think from first principles and know when to go deep versus when to move.

Hands‑on. You have a track record of building real things that work, and you have the scars (and the spreadsheets) to prove it.

Data‑driven. You design experiments, instrument everything and make decisions from the numbers.

What We Offer
  • Competitive base salary plus meaningful early‑stage equity
  • Medical, dental and vision coverage and paid time off
  • A seat at the table on a technology that could become the industry standard
  • Southern Tier New York living: short commutes, four real seasons, Finger Lakes weekends and an affordable cost of living
Obtenez votre examen gratuit et confidentiel de votre CV.

ou faites glisser et déposez votre fichier ici.

Similar jobs

Postes similaires à comparer

Head of Product Engineering
Head of Product Engineering

ChipAdd Corp. • City of Binghamton (NY)

Sur place
USD 150 000 - 210 000
Equity
Health insurance
Paid time off
Senior Package Thermal-Mechanical Engineer
Senior Package Thermal-Mechanical Engineer

ChipAdd Corp. • City of Binghamton (NY)

Sur place
USD 120 000 - 155 000
Equity
Medical, dental and vision coverage
Paid time off
+1
Mechanical Prototyping and Test Engineer
Mechanical Prototyping and Test Engineer

ChipAdd Corp. • City of Binghamton (NY)

Sur place
USD 85 000 - 145 000
Equity
Healthcare coverage
Industry-standard technology potential
+1
Senior Liquid-Cooling Engineer — Equity & Impact
Senior Liquid-Cooling Engineer — Equity & Impact

ChipAdd Corp. • City of Binghamton (NY)

Sur place
USD 120 000 - 155 000
Equity
Medical insurance
Dental insurance
+2
Senior Additive Manufacturing Engineer
Senior Additive Manufacturing Engineer

ChipAdd Corp. • City of Binghamton (NY)

Sur place
USD 115 000 - 140 000
Equity
Health insurance
Paid time off
+1
Product Engineer
Product Engineer

Aegis - an Airsys Company • Anderson (SC)

Sur place
USD 68 000 - 74 000
Lead of Thermal Systems & Simulation (Semiconductor)
Lead of Thermal Systems & Simulation (Semiconductor)

Flexcompute • Massachusetts

Sur place
USD 180 000 - 280 000
Medical insurance
Dental insurance
Vision insurance
+3
Lead Engineer, Product Engineering
Lead Engineer, Product Engineering

Danfoss • City of Utica (NY)

Sur place
USD 120 000 - 180 000
Mentoring
Training
Global opportunities
+2
Technical Solutions Manager
Technical Solutions Manager

Han's Laser Technology Industry Group Co., Ltd • San Jose (CA)

Sur place
USD 200 000 - 250 000
Product Manager – Liquid Cooling
Product Manager – Liquid Cooling

York Employment Services Inc. • Sunnyvale (CA)

Hybride
USD 150 000 - 250 000
401(k)
401(k) matching
Dental insurance
+4