- Salary range: $115,000 – $140,000 per year + equity
Most engineers bolt cooling onto a chip. You'll print it right onto the silicon.
About CHIPADD
CHIPADD is based in Binghamton, NY, close to the original birthplace of IBM, and we have leadership based in Silicon Valley as well. Our culture runs on curiosity, execution and a deep commitment to the mission.
The Role
This is part process engineer, part materials scientist, part mad scientist with a very disciplined lab notebook. If you've ever stared at a melt pool and wondered how small you could go, we should talk.
What You'll Do
- Develop, tune and lock down the metal AM process parameters (such as laser power, scan speed, hatch spacing, layer thickness, energy density and build atmosphere) for printing copper cooling features directly onto silicon
- Own the end-to-end process: surface prep, interface and metallization layers, build, post-processing and inspection, while managing thermal budget and residual stress on the silicon
- Optimize cooling feature size and geometry (pin fins, microchannels, lattices and porous structures) for thermal resistance, pressure drop and manufacturability, working closely with our thermal design team
- Evaluate and qualify new materials, including copper alloys, new powders and feedstocks, porous metals, and interlayer and bonding materials
- Plan and run designs of experiments (DOEs) to map process windows and correlate parameters with density, porosity, adhesion, surface finish and dimensional accuracy
- Characterize parts and coupons with optical microscopy, SEM, profilometry, CT, cross-sectioning, and thermal, mechanical and adhesion testing
- Write and maintain SOPs, work instructions, process control plans and process FMEAs so that every build is repeatable
- Define requirements for AM equipment, feedstock and post-processing, and evaluate vendors and new tools against them
- Stay on top of the latest AM techniques (laser powder bed fusion, micro-AM, electrochemical AM, cold spray, directed energy deposition and more) and bring the best ideas in-house
What You Bring
- MS or PHD in Mechanical or Manufacturing Engineering or a related field
- 5–7 years of hands‑on metal additive manufacturing process development
- Proven experience developing and setting metal AM process parameters to hit targets for density, porosity, surface finish and dimensional accuracy
- Experience evaluating and qualifying new materials through test coupons, microstructure analysis, and thermal, mechanical and adhesion testing
- Experience optimizing part or feature geometry for performance and manufacturability, ideally for thermal hardware such as heat sinks, cold plates or heat exchangers
- Deep working knowledge of current metal AM technologies and their trade‑offs: resolution, materials, surface finish, throughput and cost
- Track record of writing SOPs and taking a process from development to a documented, repeatable state
- Strong experimental and statistical mindset, including DOE, SPC and capability analysis (JMP, Minitab or Python)
Bonus Points
- Experience printing copper or other high‑conductivity metals
- Experience with semiconductor processing, microfabrication or advanced packaging (metallization, wafer‑level processes, dicing)
- Thermal or fluid simulation experience (Ansys, COMSOL or similar)
- Experience with micro‑scale or high‑resolution AM
- Familiarity with data center liquid cooling, direct‑to‑chip cooling or two‑phase cooling
Who Thrives Here
Hungry. You want the hard problem, and you'd rather ship a working prototype on Friday than a perfect slide deck next month.
Humble. You let the data win the argument, especially when it disagrees with you.
Smart. You learn fast, think from first principles and know when to go deep versus when to move.
Hands‑on. You have a track record of building real things that work, and you have the scars (and the spreadsheets) to prove it.
Data‑driven. You design experiments, instrument everything and make decisions from the numbers.
What We Offer
- Competitive base salary plus meaningful early‑stage equity
- Medical, dental and vision coverage and paid time off
- A seat at the table on a technology that could become the industry standard
- Southern Tier New York living: short commutes, four real seasons, Finger Lakes weekends and an affordable cost of living