Senior Process Engineer

Lumicity; San Jose (CA); Remote; USD 220,000 - 270,000; Full time

Job summary

Lumicity partners with a leading semiconductor company to hire a Senior Process Engineer who will lead hands-on development of advanced packaging processes for flip-chip technology, from early development to qualification and high-volume manufacturing, with global team collaboration.

The role offers remote work in the USA, a base salary of $220,000–$270,000 plus performance bonus and RSUs, and full-time permanent employment, with opportunities to own critical process improvements in copper

Qualifications

• 5+ years hands-on flip-chip process development experience.
• Experience with copper pillar bumping, UBM, BGA/FCBGA, and flip-chip bonding.
• Knowledge of 2.5D/3D packaging and wafer-level integration.
• Experience with process development, DOE, qualification, and HVM.
• Previous experience working with semiconductor foundries or OSATs is highly desirable.

Responsibilities

• Lead hands-on development of advanced semiconductor packaging processes, from initial development through qualification and high-volume manufacturing.

Skills

Flip-chip process development

2.5D packaging

Wafer-level integration

DOE and qualification

Tools

Copper pillar bumping

UBM

BGA/FCBGA

Flip-chip bonding

Job description

Senior Process Engineer – Advanced Packaging / Flip-Chip

Location: Fully Remote (USA)

Salary: $220,000–$270,000 Base + Bonus + RSUs

Employment: Full-Time, Permanent

Lumicity is partnered with a rapidly growing, publicly traded semiconductor company specializing in AI infrastructure, high-speed connectivity, and Silicon Photonics.

Our client is looking for an experienced Senior Process Engineer to lead hands-on development of advanced semiconductor packaging processes, from initial development through qualification and high-volume manufacturing.

What We're Looking For:

• 5+ years of hands-on flip-chip process development experience.
• Strong experience with copper pillar bumping, UBM, BGA/FCBGA, and flip-chip bonding.
• Knowledge of 2.5D/3D packaging and wafer-level integration.
• Experience with process development, DOE, qualification, and HVM.
• Previous experience working with semiconductor foundries or OSATs is highly desirable.

This opportunity offers significant technical ownership, exposure to next-generation semiconductor technologies, and collaboration with global engineering and manufacturing teams.