Senior Process Engineer - Micro-LED Bonding & Yield

Kopin Corporation; Westborough (MA); On-site; USD 130,000 - 150,000; Full time

Benefits offered by this job

Bonus

Job summary

Kopin Corporation in Westborough, MA is seeking a Senior Process Engineer to lead development, optimization, and scale-up of micro-LED display manufacturing. You will drive die-level bonding, lithography, and metal deposition processes, translating R&D into high-volume production and delivering robust process specifications.

The role requires hands-on experience with indium bumping, thermo‑compression bonding, and bonding metrology, plus strong data analysis and cross‑functional collaboration

Qualifications

• 8+ years of hands-on experience in semiconductor process engineering, focusing on die-level bonding, advanced packaging, or assembly.
• Experience with indium bumping, thermo-compression bonding, or flip-chip attach.
• Bonding metrology and failure analysis (C-SAM, X-ray, SEM/EDX, bond pull/shear testing).
• Lithography: coating, exposure, development; overlay registration; CD control.

Responsibilities

• Develop, characterize, and optimize indium bump formation processes (UBM, Indium deposition, lithography, lift-off).
• Lead the thermo-compression bonding process development for chip-to-chip and die-to-die applications; perform DOE to optimize parameters and yield.
• Collaborate with equipment suppliers to run bumping and bonding trials at vendor sites; travel required.
• Oversee tool qualifications and preventive maintenance; ensure incoming material quality.
• Develop robust process specifications, work instructions, and training materials for technicians.
• Implement SPC methodologies to monitor process stability and drive continuous improvement.

Skills

Semiconductor process engineering

Die-level bonding

DOE analysis

PVD deposition

Lithography

Data analysis

Cross-functional collaboration

Communication skills

Startup environment

Education

Bachelor’s degree in a related field

MS/PhD in Materials Science or Engineering

Tools

SEM/EDX

X-ray

FIB

Sputtering

Photolithography

Job description

Kopin Corporation in Westborough, MA is seeking a Senior Process Engineer to lead development, optimization, and scale-up of micro-LED display manufacturing. You will drive die-level bonding, lithography, and metal deposition processes, translating R&D into high-volume production and delivering robust process specifications.

The role requires hands-on experience with indium bumping, thermo‑compression bonding, and bonding metrology, plus strong data analysis and cross‑functional collaboration