Senior Micro-LED Process Engineer: Bonding & Packaging

Kopin Corporation; Westborough (MA); On-site; USD 130,000 - 150,000; Full time

Job summary

Kopin Corporation in Massachusetts is seeking a Senior Process Engineer to lead the development, optimization, and scale-up of our micro-LED display manufacturing technology. You will apply hands-on experience in die-level bonding, lithography, and metal deposition to drive a robust transition from R&D to high-volume production.

The role emphasizes DOE design, SPC implementation, root-cause analysis, and close collaboration with equipment suppliers to qualify new tools and improve yield.

Qualifications

• U.S. Citizen or permanent resident required due to ITAR
• Bachelor of Science with exceptional hands-on semiconductor experience accepted; MS/PhD preferred
• 8+ years of hands-on semiconductor process engineering experience with emphasis on die-level bonding, advanced packaging, or assembly

Responsibilities

• Lead die-level bonding process development and optimization
• Develop, characterize, and optimize indium bump formation and under bump metal (UBM) deposition
• Design, execute, and analyze DOE to map process windows and improve yield and reliability
• Implement SPC methodologies to monitor process stability and drive continuous improvement
• Collaborate with equipment suppliers for tool qualifications and in-field bonding trials
• Interface with wafer/ chip suppliers to ensure material quality and compatibility
• Document robust process specifications, work instructions, and training materials

Skills

Die-level bonding

Thermo-Compression Bonding

Flip-Chip Attach

Lithography

Metal Deposition

Data analysis

DOE design of experiments

SPC

Root-cause analysis

Communication

Cross-functional collaboration

Education

Bachelor of Science

MS/PhD in Materials Science, Chemical Engineering, Mechanical Engineering, Electrical Engineering, Physics or related field

Tools

JMP

Minitab

Job description

Kopin Corporation in Massachusetts is seeking a Senior Process Engineer to lead the development, optimization, and scale-up of our micro-LED display manufacturing technology. You will apply hands-on experience in die-level bonding, lithography, and metal deposition to drive a robust transition from R&D to high-volume production.

The role emphasizes DOE design, SPC implementation, root-cause analysis, and close collaboration with equipment suppliers to qualify new tools and improve yield.