Senior Process Engineer: Flip Chip & 3D Packaging | Equity

Langham Recruitment

San Diego (CA)

Hybrid

USD 160,000 - 190,000

Full time

22 hours ago
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Benefits offered by this job

Equity
Full benefits package

Job summary

Langham Recruitment in San Diego, CA is seeking a Senior Process Engineer to drive advanced packaging and manufacturing processes for photonics technologies. You will lead Flip Chip and Thermo-Compression Bonding efforts, support 2.5D/3D integration, and collaborate with suppliers to scale processes in a fast-growing environment.

You should bring 5+ years in manufacturing, deep expertise in Flip Chip/TCB, and strong skills in DOE, Gage R&R and statistical methods.

Qualifications

  • 5+ years in manufacturing or process engineering.
  • Strong expertise in Flip Chip and Thermo-Compression Bonding.
  • Experience with 2.5D/3D packaging and reliability challenges.
  • Familiar with DOE, Gage R&R and statistical analysis.

Responsibilities

  • Develop and optimise optoelectronic assembly processes.
  • Lead Flip Chip and TCB process development.
  • Support 2.5D/3D packaging integration.
  • Collaborate with suppliers to scale processes.
  • Design and execute DOE to improve yield and performance.
  • Monitor process health, yield, and Pareto trends.
  • Develop SOWs and project plans for new process development.

Skills

Flip Chip
Thermo-Compression Bonding
2.5D/3D packaging
DOE
Gage R&R
Statistical analysis
FMEA
Packaging reliability
Optoelectronics packaging
Manufacturing/Process engineering

Education

Bachelor's degree in Engineering, Physics or related field

Tools

JMP
Minitab

Job description

Langham Recruitment in San Diego, CA is seeking a Senior Process Engineer to drive advanced packaging and manufacturing processes for photonics technologies. You will lead Flip Chip and Thermo-Compression Bonding efforts, support 2.5D/3D integration, and collaborate with suppliers to scale processes in a fast-growing environment.

You should bring 5+ years in manufacturing, deep expertise in Flip Chip/TCB, and strong skills in DOE, Gage R&R and statistical methods.

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