Process Engineer - D2W Hybrid Bonding & 3D Packaging

Applied Materials, Inc.; Santa Clara (CA); On-site; USD 147,000 - 203,000; Full time

Benefits offered by this job

Bonus program

Stock awards

Relocation assistance

Job summary

Applied Materials, Inc. in Santa Clara, CA is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies.

You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters to work on state‑of‑the‑art 2.5D/3D advanced packaging technologies and cross‑functional collaboration with vendors; on‑the‑job training

Qualifications

• PhD or MS in Materials Science, Electrical Engineering, Applied Physics, or related STEM field.
• Experience with semiconductor manufacturing processes and DOE/SPC methods.
• Strong problem-solving and communication skills.

Responsibilities

• Develop die-to-wafer hybrid bonding processes with surface prep and alignment.
• Integrate D2W bonding with adjacent modules and perform DOE‑driven experiments.
• Own process optimization, failure analysis, and continuous engineering improvement.

Skills

Problem solving

Independent work

Communication

Team collaboration

Self starter

Education

PhD or MS in STEM

Tools

JMP

Job description

Applied Materials, Inc. in Santa Clara, CA is seeking a Process Engineer to design and optimize manufacturing processes for display and semiconductor technologies.

You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. Join the Photonics Platforms Business Group at Applied Materials’ Santa Clara headquarters to work on state‑of‑the‑art 2.5D/3D advanced packaging technologies and cross‑functional collaboration with vendors; on‑the‑job training