Senior Process Engineer

Langham Recruitment; San Diego (CA); Hybrid; USD 160,000 - 190,000; Full time

Benefits offered by this job

Equity

Full benefits package

Job summary

Langham Recruitment in San Diego, CA is seeking a Senior Process Engineer to drive advanced packaging and manufacturing processes for photonics technologies. You will lead Flip Chip and Thermo-Compression Bonding efforts, support 2.5D/3D integration, and collaborate with suppliers to scale processes in a fast-growing environment.

You should bring 5+ years in manufacturing, deep expertise in Flip Chip/TCB, and strong skills in DOE, Gage R&R and statistical methods.

Qualifications

• 5+ years in manufacturing or process engineering.
• Strong expertise in Flip Chip and Thermo-Compression Bonding.
• Experience with 2.5D/3D packaging and reliability challenges.
• Familiar with DOE, Gage R&R and statistical analysis.

Responsibilities

• Develop and optimise optoelectronic assembly processes.
• Lead Flip Chip and TCB process development.
• Support 2.5D/3D packaging integration.
• Collaborate with suppliers to scale processes.
• Design and execute DOE to improve yield and performance.
• Monitor process health, yield, and Pareto trends.
• Develop SOWs and project plans for new process development.

Skills

Flip Chip

Thermo-Compression Bonding

2.5D/3D packaging

DOE

Gage R&R

Statistical analysis

FMEA

Packaging reliability

Optoelectronics packaging

Manufacturing/Process engineering

Education

Bachelor's degree in Engineering, Physics or related field

Tools

JMP

Minitab

Job description

Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CA

A rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications.

We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes, particularly Flip Chip and Thermo-Compression Bonding (TCB).

What you’ll be doing:

• Develop and optimise optoelectronic assembly processes
• Lead Flip Chip and TCB process development
• Support 2.5D/3D packaging integration
• Work with suppliers and manufacturing partners to scale processes
• Design and execute DOE to improve yield and performance
• Monitor process health, including yield and failure Pareto trends
• Develop SOWs and project plans for new process development

What we’re looking for:

• 5+ years' experience in manufacturing/process engineering
• Strong expertise in Flip Chip and Thermo-Compression Bonding
• Experience with 2.5D/3D packaging and reliability challenges
• Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar
• Experience with FMEA
• Understanding of optoelectronic devices and packaging reliability
• Knowledge of microelectronics/photonics packaging processes
• Bachelor's degree in Engineering, Physics or a related discipline
• Comfortable working in a fast-paced, high-growth environment

This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.

Salary: $160,000–$190,000 + Equity + Full Benefits Package