Senior Flip-Chip Packaging Engineer, 2.5D/3D

Conductor; Austin, Boston, San Francisco (TX, MA, CA); Hybrid; USD 110,000 - 170,000; Full time

Job summary

Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization.

Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.

Qualifications

• Experience in flip chip packaging and assembly processes for high-performance packages.
• Knowledge of bumping technologies (solder bumps, Cu pillar, micro-bumps).
• Hands-on reliability testing and failure analysis techniques.

Responsibilities

• Develop and optimize flip chip attach processes including bump formation, placement, reflow, and underfill for high-performance semiconductor packages.
• Define and manage bump metallurgy stacks (e.g., Cu pillar, SnAg, micro-bumps) and substrate pad finishes for robust interconnect performance.
• Drive package integration from die to substrate, ensuring alignment, coplanarity, and yield optimization.
• Evaluate and mitigate assembly risks including warpage, non-wet opens, voiding, head-in-pillow, and interconnect defects.
• Collaborate with substrate vendors, OSATs, and internal teams to define design rules (pad pitch, bump pitch, keep-outs, stack-ups).
• Lead process development for reflow profiles, flux selection, cleaning, and underfill dispense/cure.
• Perform root cause analysis of assembly and reliability failures using cross-sectioning, SEM, CSAM, and other failure analysis techniques.

Skills

Flip chip packaging

Bumping technologies

Failure analysis

Cross-functional collaboration

Process development

Reliability testing

Education

B.S. in Electrical Engineering

Tools

SEM

CSAM

Cross-sectioning

Job description

Conductor seeks experienced engineers to contribute to flip chip package development and assembly for advanced semiconductor devices (2.5D/3D/chiplet/fan-out/flip-chip). This role covers bump metallurgy, substrate integration, reflow, underfill, reliability, and cross-functional support for package and system productization.

Responsibilities include developing attach processes, defining bump stacks, enabling die-to-substrate integration, and mitigating risks such as warpage and voiding.