Senior Principal Packaging Engineer: 2.5D/3D Packaging Lead

Institute of Packaging Professionals

Chandler (AZ)

On-site

USD 120,000 - 160,000

Full time

8 days ago

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Job summary

NXP Semiconductors in Chandler, AZ is seeking a seasoned Semiconductor Packaging Engineer to lead package innovation across products and technologies, focusing on analog and power delivery in vehicle electrification, robotics, and high-performance compute.

You will define architectures, materials, structures, and processes, drive cross-functional programs, monitor packaging trends, and ensure successful NPI/NTI releases, with potential international travel to sites and partners.

Qualifications

BS or higher in Mechanical, Materials, Chemical or Electrical Engineering or related field.
10+ years in semiconductor packaging development or related areas.
Experience leading cross-functional technical projects with multiple teams.
Ability to communicate technical tradeoffs and project status clearly.

Responsibilities

Define package architectures, materials, structures, and assembly processes.
Drive cross-functional programs with Marketing, Design, Product Engineering, and partners.
Monitor industry trends in advanced packaging and roadmaps.
Ensure package deliverables for NPI and NTI, including qualification and production ramp.
May involve international travel to assembly sites, OSATs, suppliers, and partners.