Senior Principal Mechanical Engineer, RF/Electronics Subsystems

globalhr; Goleta (CA); On-site; USD 146,000 - 277,000; Full time

Benefits offered by this job

Relocation eligible

Benefits package

Job summary

RTX seeks a Senior Principal Mechanical Engineer in the Electronic Warfare Mechanical Design Hardware Department to lead airborne RF and digital subsystem design from concept to production. You will drive packaging, thermal, and structural analyses, and collaborate cross-functionally with Electrical, Systems, and Manufacturing teams.

The role requires deep expertise in high-rel hardware development, COTS/MOTS, GD&T, and 3D CAD; travel 10–20% is expected. A DoD Secret clearance is required.

Qualifications

• Degree in Science, Technology, Engineering or Mathematics (STEM) and extensive related experience.
• Experience with electronics packaging for high reliability environments.
• Experience with COTS/MOTS components in hardware development.
• Proficiency with 3D CAD tools and GD&T drawing standards.

Responsibilities

• Lead mechanical design of airborne RF and digital electronics subsystems from concept to production.
• Act as mechanical technical authority to meet technical, cost, and schedule objectives.
• Communicate status and risks to leadership; present at design reviews.
• Develop requirements, design docs, trade studies, verification plans and test artifacts.
• Own subsystem-level mechanical solutions for thermal, structural, and vibration requirements.
• Collaborate with Electrical, Systems, Manufacturing, and Supply Chain teams.

Skills

Electronics packaging

COTS/MOTS

Creo/ProEngineer

GD&T

3D modeling

Education

STEM degree

Tools

Creo/ProEngineer

FEA tools

Job description

RTX seeks a Senior Principal Mechanical Engineer in the Electronic Warfare Mechanical Design Hardware Department to lead airborne RF and digital subsystem design from concept to production. You will drive packaging, thermal, and structural analyses, and collaborate cross-functionally with Electrical, Systems, and Manufacturing teams.

The role requires deep expertise in high-rel hardware development, COTS/MOTS, GD&T, and 3D CAD; travel 10–20% is expected. A DoD Secret clearance is required.