Senior PCB & Silicon Packaging Architect

Arm Limited; Chandler (AZ); Hybrid; USD 250,000 - 338,000; Full time

Benefits offered by this job

Hybrid work model

Job summary

Arm Limited seeks an Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will influence SoC platform architectures, coordinate across geographies, and drive PCB integration with packaging to deliver optimal performance and cost.

You will work with SoC teams, architects and platform leads, translating requirements into hardware architectures and providing timescale estimates for the program.

Qualifications

• Deep technical background in SoC architectures and embedded compute.
• Experience with PCIe Gen5/6/7, LPDDR5/6, CSI/DSI and embedded storage peripherals.
• Board design with complex LSIs, including FPGAs and PMICs.
• Familiarity with IC packaging and PCB signal routing for SoCs.
• Collaboration with chip packaging teams to optimize pin-outs and routing.
• Proficiency in SI/PI analysis and escape routing for high-density designs.
• Knowledge of PCB fabrication processes, stackups, vias and manufacturability.
• Ability to define and review PCB layout guidelines and constraints.
• Experience with EDA tools for schematic and PCB layout (Cadence OrCAD & Allegro).
• Strong communication and cross-geography collaboration skills.

Responsibilities

• Collaborate across geographies to specify, evaluate and develop PCB and silicon package solutions.
• Drive PCB development alongside chip packaging for optimized performance, reliability and cost.
• Translate technology requirements into platform architectures for SoC devices.
• Present technical concepts to engineers and technology leads with clarity.
• Provide timescale estimates and justification into the program plan.

Skills

SoC architectures

High-speed IO

Embedded board design

FPGA & PMICs

IC packaging knowledge

SoC pin-out optimization

SI/PI analysis

PCB fabrication know-how

Layout guidelines & constraints

EDA tools (cadence)

Tools

Cadence OrCAD

Cadence Allegro

Job description

Arm Limited seeks an Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will influence SoC platform architectures, coordinate across geographies, and drive PCB integration with packaging to deliver optimal performance and cost.

You will work with SoC teams, architects and platform leads, translating requirements into hardware architectures and providing timescale estimates for the program.