High-Speed PCB & Silicon Packaging Co-Design Engineer

Arm; Chandler (AZ); Hybrid; USD 198,000 - 268,000; Full time

Job summary

Arm seeks an Electronics Engineer specialized in PCB Silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work on systems with Arm processors, focusing on chip packaging and SoC integration for hardware platforms used in software development and validation with partners and internal teams.

You will collaborate across geographies to specify and develop solutions for PCB and silicon packaging integration, influence pinouts, and drive PCB development with the

Qualifications

• Experience with electronics and embedded compute systems.
• Knowledge of IC packaging technologies and their impact on PCB design.
• Ability to influence SoC device pin-outs for cost optimization and routing feasibility.
• Expertise in high-speed design and interface standards (PCIe, LPDDR).
• Experience with signal and power integrity analysis from board and packaging perspectives.
• Understanding of PCB fabrication (PTH/HDI), stackup, vias, and manufacturability.

Responsibilities

• Collaborate with global engineering teams to specify and develop PCB and silicon package integration.
• Influence silicon architecture definitions and package pinout trade-offs for system feasibility.
• Drive PCB development alongside the chip packaging team, optimizing breakout routing, design rules, and layer stacks.
• Provide timescale estimates and justifications to the program team.

Skills

Embedded compute

SoC packaging

PCB design

High-speed routing

SI/PI analysis

Power integrity

PCB fabrication & HDI

Schematic & layout

Tools

Cadence OrCAD

Allegro

Job description

Arm seeks an Electronics Engineer specialized in PCB Silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work on systems with Arm processors, focusing on chip packaging and SoC integration for hardware platforms used in software development and validation with partners and internal teams.

You will collaborate across geographies to specify and develop solutions for PCB and silicon packaging integration, influence pinouts, and drive PCB development with the