Senior Package Layout Engineer (2.5D/3D) for SoCs

Arm Limited; San Jose (CA); Hybrid; USD 209,000 - 283,000; Full time

Job summary

Arm Limited is seeking a Staff Engineer for the System-in-Package team to help implement next-generation SoCs for IoT, automotive, and compute spaces. This role collaborates with IP, PCB, SI/PI and systems teams across the US, France, UK, and partners.

You will contribute to 2.5D/3D packaging design, verification, and layout optimization using Cadence APD and Allegro, while driving standardization and efficient routing.

Qualifications

• Electrical Engineering degree or equivalent work experience.
• Experience with 2.5D and 3D package systems and their SI/PI requirements.
• 5-7+ years of Cadence APD & Allegro experience.
• Ability to facilitate standardization and improve efficiency.
• Willingness to learn and adapt in a collaborative environment.

Responsibilities

• Define, design and verify package designs for next-gen SoCs.
• Assist in layout and feasibility studies for size, cost, and performance.
• Provide guidance to team members and coordinate with external vendors.
• Test new methodologies to improve layout team efficiency.

Skills

Cadence APD

Allegro

2.5D/3D packages

SI/PI requirements

Python

SKILL

TCL

Education

Electrical Engineering degree or equivalent

Job description

Arm Limited is seeking a Staff Engineer for the System-in-Package team to help implement next-generation SoCs for IoT, automotive, and compute spaces. This role collaborates with IP, PCB, SI/PI and systems teams across the US, France, UK, and partners.

You will contribute to 2.5D/3D packaging design, verification, and layout optimization using Cadence APD and Allegro, while driving standardization and efficient routing.