PCB & SoC Packaging Co-Design Engineer

Arm Limited; Chandler (AZ); Hybrid; USD 198,000 - 268,000; Full time

Benefits offered by this job

Accommodations during recruitment

Job summary

Arm Limited is seeking an experienced Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work on systems that integrate Arm processors, focusing on chip packaging, SoC integration, and manufacturability for external partners and internal teams.

The role involves collaborating across geographies to optimize package pinouts, routing strategies, and signal integrity at high speeds, while driving PCB development and

Qualifications

• Strong understanding of electronics and embedded compute systems.
• Experience with IC packaging technologies and their impact on PCB design.
• Ability to influence SoC device pin-outs for cost optimization and routing feasibility.
• Knowledge of high-speed design and interface standards (PCIe, LPDDR).
• Expertise in signal and power integrity analyses for board and chip packaging.
• Familiarity with PCB fabrication processes, stackup/VIA topologies.
• Ability to review PCB layout guidelines and manufacturability constraints.
• Proficiency with Cadence OrCAD & Allegro for schematic entry and PCB layout.
• Strong communication and teamwork across geographies.

Responsibilities

• Collaborate with engineering teams across geographies to specify and develop PCB and silicon package integration solutions.
• Influence silicon architecture definition, package pinout trade-offs and system-level feasibility.
• Drive PCB development alongside the chip packaging team, including routing strategies and layer optimization.
• Provide timescale estimates and justification to the program team.

Skills

Electronics & embedded compute

IC packaging knowledge

SoC pin-out optimization

High-speed design

Signal & Power Integrity

PCB fabrication & HDI

Package-to-PCB routing

EDA tools: Cadence OrCAD/Allegro

Cross-functional collaboration

Communication skills

Tools

Cadence OrCAD

Cadence Allegro

Job description

Arm Limited is seeking an experienced Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work on systems that integrate Arm processors, focusing on chip packaging, SoC integration, and manufacturability for external partners and internal teams.

The role involves collaborating across geographies to optimize package pinouts, routing strategies, and signal integrity at high speeds, while driving PCB development and