Senior Board & Silicon Packaging Architect

Arm; Chandler (AZ); Hybrid; USD 250,000 - 338,000; Full time

Benefits offered by this job

Accommodations

Hybrid working

Equal opportunities

Job summary

Arm seeks an Electronics Engineer specializing in PCB silicon packaging co-design and system-level hardware architecture. You will collaborate with SoC teams to align requirements, evaluate design trade-offs, and drive packaging integration for high-performance embedded compute platforms.

The role focuses on developing hardware platforms around Arm IP, with emphasis on scalable PCB and packaging solutions, signal integrity, and manufacturability for delivery across geographies.

Qualifications

• Deep technical background in SoC architectures and embedded compute.
• Experience with high-speed IO standards (PCIe Gen5/6/7, LPDDR5/6, CSI, DSI) and peripherals.
• Expertise in PCB and silicon package integration, including routing and layer trade-offs.
• Collaboration with chip packaging teams to optimize pin-outs and cost.
• Proficiency in Signal and Power Integrity analysis for boards and packages.
• Knowledge of PCB fabrication processes (PTH and HDI) and substrate materials.
• Ability to define PCB layout guidelines and constraints for manufacturability.

Responsibilities

• Collaborate with global engineering groups to specify and develop PCB and silicon package integration.
• Focus on PCB development alongside the chip packaging team, including routing strategies and layer optimization.
• Translate technology requirements into platform architectures for SoC development teams.
• Communicate technical concepts clearly to audiences from Silicon to technology leads.
• Provide timescale estimates and justifications into the program team.
• Evaluate package pinout options against PCB routability, SI/PI performance, and cost.

Skills

SoC architectures

High-speed IO

Embedded board design

IC packaging impact

Packaging collaboration

Signal Integrity

PCB fabrication

Routing optimization

Power delivery

Tools

Cadence OrCAD

Allegro

Job description

Arm seeks an Electronics Engineer specializing in PCB silicon packaging co-design and system-level hardware architecture. You will collaborate with SoC teams to align requirements, evaluate design trade-offs, and drive packaging integration for high-performance embedded compute platforms.

The role focuses on developing hardware platforms around Arm IP, with emphasis on scalable PCB and packaging solutions, signal integrity, and manufacturability for delivery across geographies.