Staff Board - Package co-design Engineer

Arm Limited; Chandler (AZ); Sur place; USD 198 000 - 268 000; Plein temps

Avantages offerts par ce poste

Accommodations during recruitment

Résumé du poste

Arm Limited is seeking an experienced Electronics Engineer specializing in PCB and silicon packaging co-design to join the Packaging, Boards and Multiphysics team. You will work on systems that integrate Arm processors, focusing on chip packaging, SoC integration, and manufacturability for external partners and internal teams.

The role involves collaborating across geographies to optimize package pinouts, routing strategies, and signal integrity at high speeds, while driving PCB development and

Qualifications

• Strong understanding of electronics and embedded compute systems.
• Experience with IC packaging technologies and their impact on PCB design.
• Ability to influence SoC device pin-outs for cost optimization and routing feasibility.
• Knowledge of high-speed design and interface standards (PCIe, LPDDR).
• Expertise in signal and power integrity analyses for board and chip packaging.
• Familiarity with PCB fabrication processes, stackup/VIA topologies.
• Ability to review PCB layout guidelines and manufacturability constraints.
• Proficiency with Cadence OrCAD & Allegro for schematic entry and PCB layout.
• Strong communication and teamwork across geographies.

Responsabilités

• Collaborate with engineering teams across geographies to specify and develop PCB and silicon package integration solutions.
• Influence silicon architecture definition, package pinout trade-offs and system-level feasibility.
• Drive PCB development alongside the chip packaging team, including routing strategies and layer optimization.
• Provide timescale estimates and justification to the program team.

Connaissances

Electronics & embedded compute

IC packaging knowledge

SoC pin-out optimization

High-speed design

Signal & Power Integrity

PCB fabrication & HDI

Package-to-PCB routing

EDA tools: Cadence OrCAD/Allegro

Cross-functional collaboration

Communication skills

Outils

Cadence OrCAD

Cadence Allegro

Description du poste

Looking for your next career challenge? We seek an experienced Electronics Engineer specializing in PCB <> Silicon packaging co-design to join Arm's Packaging, Boards and Multiphysics team. You will be involved with systems that incorporate Arm processors, focusing on aspects like chip packaging and System-on-Chip (SoC) integration. We develop physical hardware platforms used for software development and validation activities for both external partners/customers and our internal development teams. The team is working at the forefront of embedded compute focusing on prototyping Arm's latest IP products.

Responsibilities:

Collaborate with engineering teams across multiple geographies to specify, evaluate, analyze and develop solutions for efficient PCB and silicon package integration to influence silicon architecture definition, package pinout trade-offs and system-level feasibility. Focus on driving the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance, reliability, and cost-effectiveness. Provide timescale estimates and justifications into the program team.

Required Skills and Experience

• Strong understanding of electronics and embedded compute systems.
• Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
• Experience of collaborating with chip packaging teams. Ability to influence and drive SoC device pin-outs for cost optimization, routing feasibility and layer trade-off analysis.
• Detailed knowledge of high-speed design and interface standards (e.g. PCIe and LPDDR memory technologies). You'll analyze and optimize signal paths to ensure signal quality, minimize noise, and prevent signal degradation, especially at high speeds.
• Expertise in escape routing analysis of high density SoC's and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
• Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
• Understanding of the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials. Ability to collaborate with PCB fabricators and CEM partners to assess manufacturability of advanced PCB technologies.
• Evaluate package pinout options against PCB routability, SI/PI performance, layer count, manufacturability, and cost. Ability to define or review PCB layout guidelines and constraints.
• Support early silicon and board architecture planning, including component placement, form-factor constraints, PDN strategy, and routing feasibility.
• Proficiency in the use of EDA tools for schematic entry and PCB layout (Cadence OrCAD & Allegro)
• Good communication and interpersonal skills. Positive can-do attitude and attention to detail.

Desirable Skills and Qualities

The following skills are not essential, but experience in any of the following areas would enhance the application:

• Experience in using Signal Integrity tools from ANSYS, Siemens EDA etc.
• Experience of design automation and scripting.
• Enjoy collaborating and working in across geographies with multiple teams.

In Return:

You will gain a deeper understanding of high-performance compute platforms! You'll be working alongside other engineering teams, in a friendly supportive environment collaborating with highly motivated, like minded engineers, producing high quality designs incorporating Arm IP. You will enjoy new technical challenges faced when using advancing technologies!

Salary Range:

$198,100-$268,000 per year

We value people as individuals and our dedication is to reward people competitively and equitably for the work they do and the skills and experience they bring to Arm. Salary is only one component of Arm's offering. The total reward package will be shared with candidates during the recruitment and selection process.

Accommodations at Arm

At Arm, we want to build extraordinary teams. If you need an adjustment or an accommodation during the recruitment process, please email [e-mail]. To note, by sending us the requested information, you consent to its use by Arm to arrange for appropriate accommodations. All accommodation or adjustment requests will be treated with confidentiality, and information concerning these requests will only be disclosed as necessary to provide the accommodation. Although this is not an exhaustive list, examples of support include breaks between interviews, having documents read aloud, or office accessibility. Please email us about anything we can do to accommodate you during the recruitment process.

Hybrid Working at Arm

Arm's approach to hybrid working is designed to create a working environment that supports both high performance and personal wellbeing. We believe in bringing people together face to face to enable us to work at pace, whilst recognizing the value of flexibility. Within that framework, we empower groups/teams to determine their own hybrid working patterns, depending on the work and the team’s needs. Details of what this means for each role will be shared upon application. In some cases, the flexibility we can offer is limited by local legal, regulatory, tax, or other considerations, and where this is the case, we will collaborate with you to find the best solution. Please talk to us to find out more about what this could look like for you.

Equal Opportunities at Arm

Arm is an equal opportunity employer, committed to providing an environment of mutual respect where equal opportunities are available to all applicants and colleagues. We are a diverse organization of dedicated and innovative individuals, and don't discriminate on the basis of race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or status as a protected veteran.