Staff SIP Engineer – Next‑Gen SoC & 3D Packaging
Semiconductor Engineering
An application made for this job — a tailored resume and cover letter that speak straight to the posting.
Job summary
Arm in California is seeking a Staff Engineer for the System-in-Package team to drive next-generation SoCs for IoT, Automotive and Compute spaces. This role collaborates across IP, PCB, SI/PI and Systems teams in France, the US, the UK and partner sites.
You will work on complex designs leveraging 2.5D and 3D technologies, coordinate with global engineering groups, and contribute to architectural and verification efforts to deliver cutting-edge solutions.
Job description
Arm in California is seeking a Staff Engineer for the System-in-Package team to drive next-generation SoCs for IoT, Automotive and Compute spaces. This role collaborates across IP, PCB, SI/PI and Systems teams in France, the US, the UK and partner sites.
You will work on complex designs leveraging 2.5D and 3D technologies, coordinate with global engineering groups, and contribute to architectural and verification efforts to deliver cutting-edge solutions.
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