SoC Packaging & PCB Co-Design Engineer

Arm Limited; Chandler, Northern (AZ, KY); Hybrid; USD 198,000 - 268,000; Full time

Job summary

Arm Limited seeks an experienced Electronics Engineer specializing in PCB and silicon package co-design for its Packaging, Boards and Multiphysics team. You’ll work on systems with Arm processors, focusing on chip packaging and SoC integration to enable hardware platforms for software development and validation.

Responsibilities include collaborating across geography to define PCB/package solutions, driving breakout/routing strategies, and estimating timelines for program teams.

Qualifications

• Strong understanding of electronics and embedded compute systems.
• Familiarity with IC packaging technologies and their impact on PCB design for SoCs.
• Experience collaborating with chip packaging teams to influence pin-outs and routing feasibility.
• Knowledge of high-speed design and interfaces (PCIe, LPDDR).
• Expertise in escape routing analysis for high-density SoCs.
• Extensive knowledge of Signal and Power Integrity analysis techniques.
• Understanding of PCB fabrication processes (PTH/HDI) and stackup/VIA topologies.
• Ability to define/review PCB layout guidelines and constraints.
• Proficiency with Cadence OrCAD and Allegro.
• Good communication and teamwork skills.

Responsibilities

• Collaborate with engineering teams across geographies to specify, evaluate, analyze and develop PCB and silicon package integration.
• Influence silicon architecture definition, package pinout trade-offs and system-level feasibility.
• Drive PCB development alongside the chip packaging team, including breakout/routing strategies and design rule optimization.
• Provide timescale estimates and justifications into the program team.

Skills

Electronics

IC packaging

Chip packaging

High-speed design

Escape routing

SI/PI analysis

PCB fabrication

Package pinout

Silicon planning

Cadence OrCAD

Allegro

Communication

Tools

Cadence OrCAD

Allegro

Job description

Arm Limited seeks an experienced Electronics Engineer specializing in PCB and silicon package co-design for its Packaging, Boards and Multiphysics team. You’ll work on systems with Arm processors, focusing on chip packaging and SoC integration to enable hardware platforms for software development and validation.

Responsibilities include collaborating across geography to define PCB/package solutions, driving breakout/routing strategies, and estimating timelines for program teams.