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Advanced Micro Devices is seeking a packaging technology lead to drive the development of substrate and board technologies that support the company’s product roadmap. You will guide cross-functional teams, coordinate with architects, designers, and suppliers to deliver high-yield, cost-effective solutions from concept through NPI.
The ideal candidate has hands-on experience in packaging, materials, and equipment, with a track record of delivering advanced substrate innovations in OSAT, fabless,
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In this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap.
Ideal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams.
This role is not eligible for Visa Sponsorship.
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AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.
AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.
This posting is for an existing vacancy.