Packaging Substrate Development Engineer

Advanced Micro Devices

Austin (TX)

Hybrid

USD 150,000 - 190,000

Full time

2 days ago
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Job summary

Advanced Micro Devices is seeking a packaging technology lead to drive the development of substrate and board technologies that support the company’s product roadmap. You will guide cross-functional teams, coordinate with architects, designers, and suppliers to deliver high-yield, cost-effective solutions from concept through NPI.

The ideal candidate has hands-on experience in packaging, materials, and equipment, with a track record of delivering advanced substrate innovations in OSAT, fabless,

Qualifications

  • Hands-on leadership in cross-functional teams to certify technology, reduce yield/cost, and set up equipment.
  • Ability to communicate complex technical challenges to executives; deep knowledge of packaging and board design rules.

Responsibilities

  • Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors.
  • Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements.
  • Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
  • Partner with product, quality and manufacturing engineering teams to meet milestones for manufacturability, yield and reliability from concept through NPI.
  • Qualify package substrates of new products meeting cost and yield targets.

Skills

Cross-functional leadership
Technical communication
Packaging & board design knowledge

Education

BS/MS/PhD in solid state physics, Chemistry, Materials science, Chemical engineering or equivalent

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believetechnology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMDis shapingthefuture.

Whetheryou’redesigning next-gen processors, enabling AI breakthroughs, orbringing leading edge products to market, every role at AMD contributes to something bigger— technologythat moves the world forward.Join us and, together, we’ll advance your career.

THE ROLE

In this exciting role you will be leading packaging technology development for supply chain bring up of advanced substrate technologies to support AMD's product roadmap.

THE PERSON

Ideal will have a hands-on approach with excellent oral and written communication skills to communicate ideas to stakeholders and global cross functional teams.

KEY RESPONSIBILITIES
  • Define advanced substrate and board technology roadmap across pitch scaling, power delivery, signal integrity and cost vectors
  • Partner with AMD architects, designers, and product owners to define high yielding, cost effective substrate solutions which meet product requirements
  • Select development partners to bring into AMD supply chain to enable industry leading substrate and PCB technology building blocks.
  • Partner with product, quality and manufacturing engineering teams to meet various milestones for manufacturability, yield and reliability from concept through NPI.
  • Qualify package substrates of new products meeting cost and yield targets.
PREFERRED EXPERIENCE
  • E Experience leading cross functional teams to achieve technology certification, yield/cost reduction initiatives, equipment set up.
  • C Communicating complex technical challenges to executive level/management. Deep knowledge of packaging and board design rules, process flows, materials, and equipment.
  • P Proven track record in developing advanced packaging technologies at a substrate supplier, OSAT or Fabless/IDM, as well as identifying and enabling new substrate and PCB vendors
ACADEMIC CREDENTIALS
  • BS/MS/PhD in solid state physics, Chemistry, Material science, Chemical engineering or equivalent.

This role is not eligible for Visa Sponsorship.

#LI-HYBRID

#LI-AP1

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.

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