Product Engineering Architect - 3DIC & Hetero Packaging

Cadence; San Jose (CA); On-site; USD 186,000 - 345,000; Full time

Job summary

Cadence is seeking a Product Engineering Architect in San Jose, CA to provide senior technical leadership for Cadence Virtuoso Heterogeneous Integration technologies. You will partner with customers, Product Management, R&D, Product Validation, and Application Engineering to shape product strategy and drive innovative, deliverable solutions.

You will lead the roadmap for physical implementation flows around 3D IC and advanced packaging, guiding teams through development cycles and engaging early

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• 15+ years of experience in product engineering or technical leadership.
• Deep expertise in semiconductor design, physical implementation, or EDA product engineering.

Responsibilities

• Drive end-to-end system design solutions for 3D IC, heterogeneous integration and advanced packaging.
• Lead strategic customer engagements and guide deployment of advanced design flows.
• Influence product roadmap by synthesizing customer requirements and market trends.
• Produce PRS and technical use cases to support R&D and product validation.
• Mentor engineers on design-flow challenges and cross-functional collaboration.
• Create customer-ready technical collateral and enablement materials.

Skills

Technical leadership

Strategic collaboration

Executive communication

Mentoring

Cross-functional teamwork

Education

BS in Electrical Engineering

Tools

Cadence Virtuoso

APD+

Cadence SKILL language

Job description

Cadence is seeking a Product Engineering Architect in San Jose, CA to provide senior technical leadership for Cadence Virtuoso Heterogeneous Integration technologies. You will partner with customers, Product Management, R&D, Product Validation, and Application Engineering to shape product strategy and drive innovative, deliverable solutions.

You will lead the roadmap for physical implementation flows around 3D IC and advanced packaging, guiding teams through development cycles and engaging early