Remote Solutions Architect - 3D-IC & Chiplet Packaging

Cadence; Seat Pleasant (MD); Hybrid; USD 162,000 - 302,000; Full time

Job summary

Cadence is seeking a Solutions Architect Engineer to lead application support for 3D-IC packaging and chiplet-based architectures. You will work with customers to deploy Cadence design flows, develop workflows, and deliver demonstrations and training.

The role requires 10+ years in semiconductor packaging, deep knowledge of advanced packaging methods, and strong communication. Remote or hybrid work in the United States with occasional travel.

Qualifications

• Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline.
• 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
• Strong knowledge of advanced package design methodologies and 2.5D/3D-IC integration.
• Experience performing package layout, routing, constraint management, and package signoff.
• Excellent customer-facing communication and presentation skills.

Responsibilities

• Provide technical leadership and application support for Cadence 3D-IC design solutions.
• Assist customers with advanced package architecture, design implementation, and methodology development.
• Develop and demonstrate complete packaging workflows for Organic substrates, Silicon interposers, Wafer Level Packaging, 2.5D/3D-IC integration, and chiplet architectures.
• Support customer evaluations, proof-of-concepts, benchmarks, and production deployments.
• Deliver technical presentations, product demonstrations, workshops, and training sessions.
• Collaborate with sales teams for pre-sales support and capture customer requirements for R&D.

Skills

Advanced package design

2.5D and 3D-IC integration

Chiplet-based architectures

High-speed signal design

Power delivery networks

Package layout/Routing

Education

Bachelor's degree (Masters preferred) in Electrical or Electronics Engineering, or related discipline

Tools

Cadence Integrity 3D-IC Platform

Cadence Sigrity

Cadence Clarity 3D Solver

Cadence Allegro X APD

Job description

Cadence is seeking a Solutions Architect Engineer to lead application support for 3D-IC packaging and chiplet-based architectures. You will work with customers to deploy Cadence design flows, develop workflows, and deliver demonstrations and training.

The role requires 10+ years in semiconductor packaging, deep knowledge of advanced packaging methods, and strong communication. Remote or hybrid work in the United States with occasional travel.