Senior Packaging & PCB Design Automation Engineer

Amazon

Austin (TX)

On-site

USD 120,000 - 180,000

Full time

8 days ago

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Job summary

Annapurna Labs is seeking a Senior Design Automation Engineer to join our hardware team. You will contribute to the physical design of advanced IC packages and PCBs for next-generation machine learning and data center ASICs.

You will develop automation to enable packaging teams from floor planning through tape-out, working with senior engineers and manufacturing to deliver production-ready designs. You will evaluate EDA offerings, develop workflows across die RDL, interposer and PCB levels, and

Qualifications

Hands-on experience with hardware design automation for IC packaging and PCB layouts.
Ability to develop automated design workflows across floorplanning, routing, and tape-out.
Experience integrating physical verification checks into design cycles.

Responsibilities

Develop and deploy design methodologies for Package/PCB layout across the design cycle.
Evaluate and recommend advanced packaging features and EDA tools.
Deliver automation for high-density interconnects including RDL, microbumps, and substrates.
Collaborate with cross-functional teams on co-optimization across die, interposer, and PCB levels.
Develop data integration flows for co-design data across Package, PCB and SI/PI flows.
Develop software in Python, Skill, TCL; utilize AI coding agents to speed development.
Identify methodologies to integrate physical verification checks into design cycles.
Follow package design rules with OSAT partners to ensure DFM compliance.
Collaborate with SI/PI engineers to incorporate electrical constraints into layouts.