Senior Design Automation Engineer – Packaging & PCB Chips

Amazon Web Services (AWS); Austin (TX); On-site; USD 185,000 - 250,000; Full time

Benefits offered by this job

Health insurance

401(k) matching

Paid time off

Parental leave

RSUs

Job summary

Annapurna Labs (U.S.) Inc. in Austin, TX is seeking a Senior Design Automation Engineer to advance physical design for next-generation ML and data center ASICs.

You will build automation for die floor planning, RDL routing, and PCB/tape-out processes, collaborating with SI/PI, thermal, and manufacturing teams. Candidates have a strong background in packaging and PCB flows, with 7+ years in physical design tools and 10+ years in automation.

Qualifications

• Bachelor's degree required in Electrical Engineering, Computer Science, or related field.
• 7+ years of experience with physical design tools across Package and PCB domains (Allegro, APD, 3DICC, Expedition).
• 10+ years of automation experience for physical designs.

Responsibilities

• Develop and deploy efficient design methodologies for Package and PCB layout across the design cycle.
• Evaluate and recommend industry EDA tools for advanced packaging features (2.5D, 3D-IC, FOWLP).
• Deliver custom design automation to improve RDL and substrate routing for high-density interconnects.

Skills

Allegro Packaging Tools

APD

3DICC

Expedition

Education

Bachelor's degree in Electrical Engineering or Computer Science

Master's or Ph.D. in EE or related field

Tools

Allegro

APD

3DICC

Expedition

Job description

Annapurna Labs (U.S.) Inc. in Austin, TX is seeking a Senior Design Automation Engineer to advance physical design for next-generation ML and data center ASICs.

You will build automation for die floor planning, RDL routing, and PCB/tape-out processes, collaborating with SI/PI, thermal, and manufacturing teams. Candidates have a strong background in packaging and PCB flows, with 7+ years in physical design tools and 10+ years in automation.