Senior Packaging & PCB Design Automation Engineer

Amazon Inc.; Omaha, Northern (NE, KY); Hybrid; USD 185,000 - 250,000; Full time

Job summary

Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen ML and data center ASICs. You will develop automation to enable physical design teams from floor planning through tape‑out and manufacturing release.

You will work with senior engineers and cross‑functional groups to optimize die RDL, interposer and PCB layouts, evaluate EDA tools, and implement scripting in Python, Skill and TCL

Qualifications

• 7+ years of experience with physical design tools across Package and PCB domains.
• 10+ years of automation experience for physical designs.

Responsibilities

• Develop and deploy design methodologies to support Package and PCB layout across the design cycle.
• Evaluate industry EDA offerings and recommend advanced packaging features (2.5D/3D-IC) and related tech.
• Deliver custom design automation to improve RDL and substrate routing for high-density interconnects.
• Collaborate with cross-level teams for co-optimization across die RDL, interposer/substrate, and PCB levels.
• Develop data integration flows for co-design data across Package, PCB and SI/PI flows.
• Develop software in Python, Skill, TCL and leverage AI coding tools.
• Integrate physical verification checks (DRC, connectivity, shorts/opens) into cycles.
• Support package design rules with OSATs to ensure DFM compliance.
• Work with SI/PI engineers to apply electrical constraints in layout.

Skills

Design automation

Python

Skill

TCL

Team collaboration

Education

Bachelor's in Computer Science/Engineering

Master's/PhD preferred

Tools

Allegro

APD

3DICC

Expedition

Job description

Annapurna Labs seeks a Senior Design Automation Engineer to join our hardware team and contribute to the physical design of advanced IC packages and PCBs for next‑gen ML and data center ASICs. You will develop automation to enable physical design teams from floor planning through tape‑out and manufacturing release.

You will work with senior engineers and cross‑functional groups to optimize die RDL, interposer and PCB layouts, evaluate EDA tools, and implement scripting in Python, Skill and TCL