Senior Packaging Engineer, Power Semiconductors

Charlesbrownrecruitment; United States; On-site; USD 90,000 - 120,000; Full time

Job summary

A leading pre-IPO technology firm is looking for a Senior Packaging Engineer to lead the development of innovative packaging technologies for power semiconductor devices. This role involves driving package technology from concept through production, collaborating cross-functionally, and ensuring competitive advantages through strategic decisions. Candidates should have an MS or PhD in Mechanical Engineering or Materials Science, along with deep expertise in thermal and thermo-mechanical simulation tools. Strong program management and collaboration skills are essential.

Qualifications

• Deep expertise in thermal and thermo-mechanical simulation and modeling tools.
• Strong knowledge of semiconductor packaging processes and materials.
• Experience with power semiconductor packages (TO, DFN/QFN, TOLL, power modules).

Responsibilities

• Lead package technology development from concept through production.
• Drive thermal and thermo-mechanical modeling initiatives.
• Develop innovative packaging architectures for power semiconductor devices.

Skills

Thermal and thermo-mechanical simulation

Package development

Cross-functional collaboration

Program management

Education

MS or PhD in Mechanical Engineering

Materials Science

Job description

A leading pre-IPO technology firm is looking for a Senior Packaging Engineer to lead the development of innovative packaging technologies for power semiconductor devices. This role involves driving package technology from concept through production, collaborating cross-functionally, and ensuring competitive advantages through strategic decisions. Candidates should have an MS or PhD in Mechanical Engineering or Materials Science, along with deep expertise in thermal and thermo-mechanical simulation tools. Strong program management and collaboration skills are essential.