Senior Semiconductor Packaging Process Engineer

Dormont Manufacturing Co; Gardena (CA); On-site; USD 140,000 - 180,000; Full time

Benefits offered by this job

Eligibility for company stock options

Comprehensive medical, vision, and dental insurance

Paid parental leave

401(k) retirement plan access

Relocation assistance

Job summary

Dormont Manufacturing Co is seeking a Senior Process Engineer to own the development and qualification of semiconductor packaging processes.

The candidate will lead R&D through production ramp, ensuring high-volume yields and process optimization. Responsibilities include developing wafer prep processes, collaborating with cross-functional teams, and driving continuous improvements. Benefits include competitive salary and comprehensive insurance.

Qualifications

• Extensive hands-on semiconductor process-development experience, preferably 2+ years.
• Demonstrated success with flip-chip bonding, wafer processing, and wire bonding.
• Willingness to work extended hours, including weekends.

Responsibilities

• Own development of wafer prep and die-level packaging processes.
• Translate package designs into high volume production processes.
• Establish process limits and feedback constraints as design rules.

Skills

Hands-on semiconductor process development

Troubleshooting skills

Expertise in statistical quality control

Familiarity with cleanroom environments

Education

MS or PhD in Materials Science, Chemical Engineering, Electrical Engineering, or similar

Job description

Dormont Manufacturing Co is seeking a Senior Process Engineer to own the development and qualification of semiconductor packaging processes.

The candidate will lead R&D through production ramp, ensuring high-volume yields and process optimization. Responsibilities include developing wafer prep processes, collaborating with cross-functional teams, and driving continuous improvements. Benefits include competitive salary and comprehensive insurance.