Global Packaging Tech Director – Semiconductors

Cie Dfw; Dallas, Northern (TX, KY); Hybrid; USD 180,000 - 280,000; Full time

Job summary

Diodes Incorporated seeks a Director/Sr. Director of Packaging Technology to lead global teams in packaging for high‑performance semiconductor products.

You will guide package architectures and assembly processes, ensuring reliability and cross‑functional collaboration with design, manufacturing, suppliers and quality teams. The role requires deep expertise in semiconductor packaging and a proven track record of bringing analog and power products from concept through qualification and

Qualifications

• 15+ years direct experience in semiconductor packaging.
• 10+ years global team leadership in packaging
• Strong knowledge of packaging technologies, materials and assembly processes.

Responsibilities

• Lead design, development and qualification of semiconductor packaging solutions (Flip-chip, WLP/FOWLP, panel-level, SiP, MCM).
• Define package architectures based on electrical, thermal, mechanical and cost requirements.
• Drive technology selection and development for new product introductions.
• Collaborate with IC design, substrate, board, thermal and manufacturing teams for performance.
• Lead qualification activities, DOE planning and reliability testing.
• Resolve packaging issues during NPI, qualification and ramp to production.

Skills

Semiconductor packaging

Global team leadership

DFM (design for manufacturability)

Cross-functional collaboration

Thermal analysis

Education

MSc or PhD in Electrical Engineering

Tools

DOE planning

Job description

Diodes Incorporated seeks a Director/Sr. Director of Packaging Technology to lead global teams in packaging for high‑performance semiconductor products.

You will guide package architectures and assembly processes, ensuring reliability and cross‑functional collaboration with design, manufacturing, suppliers and quality teams. The role requires deep expertise in semiconductor packaging and a proven track record of bringing analog and power products from concept through qualification and