Principal Mechanical Engineer, RF Packaging & Thermal

MACOM; Northampton (MA); On-site; USD 100,000 - 130,000; Full time

Job summary

A leading semiconductor company in Northampton seeks a Principal Mechanical Engineer to design and develop packaging for electronic products. The ideal candidate will possess a mechanical engineering degree and over 8 years of relevant experience, particularly in RF product packaging. Responsibilities include design ownership, mechanical analysis, and collaboration with cross-functional teams. The position requires US citizenship due to regulatory requirements.

Qualifications

• 8+ years of experience in electronics packaging role.
• Experience with RF and millimeter wave product packaging.
• Familiar with finite element analysis and computational fluid dynamics.

Responsibilities

• Support new package design and mechanical aspects of designs.
• Interface with customers and internal teams to meet design requirements.
• Conduct mechanical analyses including structural and reliability assessments.

Skills

Design for Manufacturability

Thermal Analysis

Problem Solving

3D CAD Tools Proficiency

Education

Mechanical Engineering Degree

Tools

SolidWorks

AutoCAD

Job description

A leading semiconductor company in Northampton seeks a Principal Mechanical Engineer to design and develop packaging for electronic products. The ideal candidate will possess a mechanical engineering degree and over 8 years of relevant experience, particularly in RF product packaging. Responsibilities include design ownership, mechanical analysis, and collaboration with cross-functional teams. The position requires US citizenship due to regulatory requirements.