Senior Electronic Packaging Engineer for Sensor Modules

Apple Inc.

San Diego (CA)

Hybrid

USD 175,000 - 309,000

Full time

14 days+

Get a reply from this employer

Your resume and cover letter, tailored to exactly what they’re hiring for.

Get past ATS filters

Benefits offered by this job

Medical and dental coverage
Stock programs
Tuition reimbursement
Relocation

Job summary

Apple Inc. in San Diego is seeking a Senior Electronic Packaging Engineer to lead module packaging development for consumer products. You will own the process development for New Product Introduction, architect concepts, and define flows to enable high-volume production with OSAT partners.

The role requires a track record of shipping products, deep expertise in assembly processes, and strong leadership. You will collaborate across design, materials science, and operations to bring

Qualifications

  • BS and 10+ years of relevant industry experience.
  • Experience shipping products with external manufacturing partners.
  • Ability to lead cross-functional teams and communicate effectively.

Responsibilities

  • Own process equipment definition, material selection, and flow design for module packaging.
  • Manage packaging processes and assess impact of materials on system integration.
  • Develop new packaging concepts from proofs to high-volume production.
  • Collaborate with reliability and design teams to address failures via FMEA.
  • Integrate simulations to validate design impact before development.
  • Coordinate with module integrators and suppliers to ensure project success.
  • Present concepts and data at team and executive reviews.
  • Leverage AI to improve project efficiency.

Skills

Cross-functional leadership
Semiconductor packaging
AI in packaging
Wafer thinning
OSAT collaboration
Lead process development
DOE/Root Cause Analysis

Education

BS

Tools

Simulation software

Job description

Apple Inc. in San Diego is seeking a Senior Electronic Packaging Engineer to lead module packaging development for consumer products. You will own the process development for New Product Introduction, architect concepts, and define flows to enable high-volume production with OSAT partners.

The role requires a track record of shipping products, deep expertise in assembly processes, and strong leadership. You will collaborate across design, materials science, and operations to bring

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

Senior IC Package & Module Integration Engineer
Senior IC Package & Module Integration Engineer

Apple Inc. • San Francisco (CA)

On-site
USD 184,700 - 324,800
Senior IC Packaging Engineer - Innovative Silicon Solutions
Senior IC Packaging Engineer - Innovative Silicon Solutions

Apple Inc. • United States

Hybrid
USD 185,000 - 325,000
Process Engineer
Process Engineer

Apple Inc. • San Diego (CA)

Hybrid
USD 175,000 - 309,000
Medical and dental coverage
Stock programs
Tuition reimbursement
+1
Lead IC Packaging & Integration Engineer
Lead IC Packaging & Integration Engineer

Apple Inc. • San Francisco (CA)

On-site
USD 185,000 - 325,000
Medical and dental coverage
Employee stock programs
Relocation assistance
Senior IC Packaging Architect & Integration Lead
Senior IC Packaging Architect & Integration Lead

Apple Inc. • San Francisco (CA)

On-site
USD 184,700 - 324,800
Employee stock programs
Medical and dental coverage
Relocation assistance
+1
Senior IC Packaging Engineer – WLP & Wafer Tech Innovator
Senior IC Packaging Engineer – WLP & Wafer Tech Innovator

Apple • San Francisco (CA)

On-site
USD 180,000 - 260,000
Senior Packaging Engineer - Advanced Module Packaging
Senior Packaging Engineer - Advanced Module Packaging

Analog Devices, Inc. • San Jose (CA)

On-site
USD 130,000 - 188,000
Discretionary bonus
Medical, vision and dental coverage
401k
+1
Package Integration Engineer
Package Integration Engineer

Apple Inc. • San Francisco (CA)

On-site
USD 184,700 - 324,800
Packaging Engineer
Packaging Engineer

Apple • San Francisco (CA)

On-site
USD 180,000 - 260,000
IC Packaging Engineer - 2.5D/3D SoC Lead
IC Packaging Engineer - 2.5D/3D SoC Lead

Apple Inc. • Santa Clara (CA)

On-site
USD 143,100 - 264,200