Senior Director, Advanced IC Packaging Leadership

Advanced Micro Devices, Inc.; San Jose, Northern (CA, KY); Hybrid; USD 260,000 - 390,000; Full time

Job summary

Advanced Micro Devices, Inc. in San Jose, CA, is seeking a Senior Director of Packaging Engineering to lead strategy, development, and execution of advanced IC packaging technologies across AMD's product portfolio.

You will build a global engineering organization, guide packaging from concept through manufacturing ramps, and partner with suppliers to meet performance, reliability, cost, and schedule targets.

Qualifications

• Significant and progressive experience in semiconductor IC packaging engineering.
• Experience developing and qualifying packaging solutions for complex digital, mixed-signal, RF, or high-speed silicon.
• Deep, hands-on technical expertise across advanced packaging technologies (WLCSP, flip-chip, chip-on-chip, SiP, 2.5D/3D, chiplet interconnect).
• Demonstrated expertise in package-level signal integrity and power integrity engineering, including modeling and co-design with SerDes teams.
• Proven experience managing OSAT, substrate, and/or PWB supplier partnerships and high-volume manufacturing ramps.
• Experience leading global engineering teams and hiring, developing, retaining technical talent.
• Excellent cross-functional leadership and communication skills, with ability to present to executives.

Responsibilities

• Lead strategy and execution of advanced IC packaging technologies across AMD's product portfolio.
• Build and mentor a global engineering team; develop talent with SI/PI and thermal design expertise.
• Own end-to-end packaging development from concept through NPI and high-volume manufacturing.
• Direct package-level signal integrity and power integrity co-design strategy and interconnect optimization.
• Own thermal and mechanical package design strategy, including simulations and reliability.
• Partner with OSAT, substrate, and PWB suppliers on technology development and capacity planning.
• Represent packaging strategy in executive reviews and with customers as appropriate.
• Drive innovation in heterogeneous integration and chiplet-based architectures.

Skills

Semiconductor IC packaging

Packaging engineering leadership

OSAT partnerships

Power integrity

Signal integrity

Thermal/Mechanical design

Chiplet interconnects

Multi-die packaging

Cross-functional leadership

Executive communication

Education

Bachelor's degree in Electrical Engineering / related field

MS or PhD preferred

Job description

Advanced Micro Devices, Inc. in San Jose, CA, is seeking a Senior Director of Packaging Engineering to lead strategy, development, and execution of advanced IC packaging technologies across AMD's product portfolio.

You will build a global engineering organization, guide packaging from concept through manufacturing ramps, and partner with suppliers to meet performance, reliability, cost, and schedule targets.