Senior Package Silicon Integration Engineer

1000 Micron Technology, Inc.

Boise (ID)

On-site

USD 110,000 - 150,000

Full time

4 days ago
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Benefits offered by this job

Medical plans
Dental plans
Vision plans
Paid time off

Job summary

1000 Micron Technology, Inc. in Boise, Idaho seeks a Package Development Engineer to drive CPI integration strategies across global teams, define roadmaps, and establish design guidelines for flip chip, wire bond, and 3DS packages, using AI tools to monitor silicon health.

Requires a BS or higher in engineering and 5+ years in chip package interactions and reliability. Strong communication and collaboration skills are essential to deliver high-quality memory and storage solutions.

Qualifications

  • BS or higher in Materials, Mechanical, Chemical or Electrical Engineering.
  • 5+ years of relevant industry experience.
  • Experience with chip package interactions and reliability.

Responsibilities

  • Develop systems for monitoring E2E CPI health with internal teams and AI tools.
  • Lead CPI package design rules and maintain design rule manuals for various packages.
  • Create and maintain technology roadmaps and present as needed.
  • Support CPI test vehicle development and reliability characterization efforts.
  • Collaborate with CPI engineering, package design, Fab BEOL, and global quality to identify failure mechanisms and mitigate CPI risks.
  • Create AI agents and compiling summaries from diverse data sources.

Skills

CPI health monitoring
Package design rules
Roadmap development
Technical communication
AI-enabled tooling

Education

Bachelor's degree or higher in Engineering

Job description

1000 Micron Technology, Inc. in Boise, Idaho seeks a Package Development Engineer to drive CPI integration strategies across global teams, define roadmaps, and establish design guidelines for flip chip, wire bond, and 3DS packages, using AI tools to monitor silicon health.

Requires a BS or higher in engineering and 5+ years in chip package interactions and reliability. Strong communication and collaboration skills are essential to deliver high-quality memory and storage solutions.

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