Lead Memory Packaging Engineer – High-Speed DRAM & HVM

Micron Technology; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time-off and holidays

Paid family leave

Job summary

Micron Technology in Boise, Idaho seeks a Senior Package Design Engineer to lead co-design activities for advanced DRAM and memory products. You will collaborate globally with cross-functional teams to define and drive product concepts.

Ideal candidates will have a Master's degree in Electrical Engineering or a related field combined with extensive hands-on experience in semiconductor package design. Micron offers robust benefits and a supportive work environment.

Qualifications

• Master's degree in Electrical Engineering or similar with 5+ years of experience.
• Hands-on proficiency with EDA tools.
• Experience in advanced memory substrate design and collaboration with SI and PI teams.

Responsibilities

• Lead co-design activities with diverse teams.
• Define and optimize package architectures for DRAM products.
• Conduct DFMEA reviews and feasibility studies.

Skills

Advanced memory substrate design

Hands-on proficiency with EDA tools

Collaboration with Signal Integrity and Power Integrity teams

Experience in semiconductor package design

Education

Master's degree in Electrical or Mechanical Engineering

Bachelor's degree in related field

Tools

Cadence Allegro Package Designer

Siemens/MentorGraphics Xpedition

AutoCAD

Job description

Micron Technology in Boise, Idaho seeks a Senior Package Design Engineer to lead co-design activities for advanced DRAM and memory products. You will collaborate globally with cross-functional teams to define and drive product concepts.

Ideal candidates will have a Master's degree in Electrical Engineering or a related field combined with extensive hands-on experience in semiconductor package design. Micron offers robust benefits and a supportive work environment.