Lead Silicon Photonics & Advanced Packaging Engineer

Micron Technology, Inc; Boise (ID); Hybrid; USD 150,000 - 210,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Principal Photonics Integration Engineer to lead silicon photonics integration from concept to manufacturing readiness, partnering across design, device, packaging, and manufacturing teams.

You will drive AI-enabled engineering initiatives, program leadership, and cross-functional collaboration to advance memory, storage, and photonics technologies shaping data infrastructure and AI workloads.

Qualifications

• A PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering, or related field, or equivalent experience, is required along with over 3 years of applicable industry experience.
• Experience integrating silicon photonics processes in semiconductor development or manufacturing environments.
• Strong knowledge of semiconductor process integration, wafer fabrication, process characterization, DOE methodology, and statistical analysis.
• Experience with process flow architecture, device integration, design rule development, and tape out execution.
• Demonstrated success leading multi-functional technical projects and using data-driven approaches to solve engineering challenges.

Responsibilities

• Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept through manufacturing readiness.
• Lead integration and process development for photonic devices, optical interconnects, advanced packaging solutions, and heterogeneous integration architectures.
• Drive process characterization, DOE execution, yield improvement, defect reduction, root cause investigations, and process optimization activities.
• Partner with design, device, packaging, manufacturing, and supplier teams to support design rule development, tapeouts, and technology transfers.
• Lead technical programs, technology roadmaps, and AI-enabled engineering initiatives that improve development efficiency and product performance.

Skills

Silicon photonics integration

DOE methodology

Statistical analysis

Program leadership

Cross-functional collaboration

AI-enabled engineering tools

Education

PhD in Electrical Engineering, Materials Science, Physics, Photonics, Semiconductor Engineering or related field

MS with >5 years of relevant industry experience

Bachelor's degree with 7+ years in industry

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Principal Photonics Integration Engineer to lead silicon photonics integration from concept to manufacturing readiness, partnering across design, device, packaging, and manufacturing teams.

You will drive AI-enabled engineering initiatives, program leadership, and cross-functional collaboration to advance memory, storage, and photonics technologies shaping data infrastructure and AI workloads.