Principal Silicon Photonics Integration Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. seeks a Principal Photonics Integration Engineer in Boise, Idaho to lead silicon photonics and heterogeneous integration efforts from concept through manufacturing readiness.

You will guide end-to-end process integration, drive advanced packaging, device development, and program leadership across design, device, packaging, and manufacturing teams to accelerate the technology roadmap and AI-enabled tooling.

Qualifications

• PhD or equivalent with extensive industry experience required.
• Master's +5+ years or Bachelor's +7+ years acceptable.
• Experience integrating silicon photonics in semiconductor environments.
• Strong knowledge of process integration, wafer fabrication, DOE, and statistics.
• Proven track record leading multi-disciplinary projects and data-driven problem solving.

Responsibilities

• Develop and optimize end-to-end process integration for silicon photonics from concept to manufacturing readiness.
• Lead integration and process development for photonic devices and heterogeneous architectures.
• Drive DOE, yield improvement, defect reduction, and root-cause analyses.
• Collaborate with design, device, packaging, manufacturing, and supplier teams on tapeouts and transfers.
• Lead technical programs, roadmaps, and AI-enabled engineering initiatives.

Skills

Silicon photonics

Heterogeneous integration

AI-enabled engineering tools

Cross-functional leadership

Project leadership

Education

PhD in Electrical Engineering/Materials Science/Photonics/SEM

Master's degree +5y experience

Bachelor's degree +7y experience

Tools

DOE methodology

Statistical analysis

Wafer fabrication

Tape-out execution

Advanced packaging

Job description

Micron Technology, Inc. seeks a Principal Photonics Integration Engineer in Boise, Idaho to lead silicon photonics and heterogeneous integration efforts from concept through manufacturing readiness.

You will guide end-to-end process integration, drive advanced packaging, device development, and program leadership across design, device, packaging, and manufacturing teams to accelerate the technology roadmap and AI-enabled tooling.