Senior Package Silicon Integration Engineer

Micron; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision insurance

Paid time off

Paid holidays

401(k)

Job summary

Micron Technology in Boise, Idaho, is seeking a Package Development Engineer to drive silicon and package integration within the CPI team. You will partner with global engineering groups to deliver high-quality products and develop technical roadmaps.

You will use AI-enabled tools to enhance productivity, support reliability plans, and collaborate across multiple functions to resolve complex packaging challenges. A Bachelor’s degree and 5+ years of experience are required.

Qualifications

• Bachelor’s degree in Materials, Mechanical, Chemical, or Electrical Engineering.
• 5+ years of relevant industry experience.
• Experience with chip package interactions and 1st level chip interconnect reliability.
• Experience with component package materials & BOM selection and package assembly.
• Excellent communication skills with the ability to convey sophisticated technical concepts to both technical and non-technical partners.

Responsibilities

• Develop systems/methods for monitoring E2E CPI health, collaborating with internal teams and using capability of AI tools.
• Lead CPI package design rules in the package design rule management system and maintain design rule manuals for flip chip, wire bond, and 3DS packages.
• Create and maintain technology roadmaps and present as needed.
• Support CPI test vehicle development and reliability characterization efforts as needed.
• Collaborate with CPI engineering, package design, Fab BEOL process integration, development product engineering, and global quality to identify NUDDs and potential failure mechanisms, provide CPI risk assessments, and provide CPI risk mitigation solutions.
• Create AI agents and compiling summaries from diverse data sources

Skills

Chip Package Interactions

Technical problem-solving

AI-enabled tooling

Communication

System monitoring

Education

Bachelor's degree (Materials, Mechanical, Chemical, or Electrical Engineering)

Tools

CAD/CAE tools

Reliability testing equipment

Job description

Micron Technology in Boise, Idaho, is seeking a Package Development Engineer to drive silicon and package integration within the CPI team. You will partner with global engineering groups to deliver high-quality products and develop technical roadmaps.

You will use AI-enabled tools to enhance productivity, support reliability plans, and collaborate across multiple functions to resolve complex packaging challenges. A Bachelor’s degree and 5+ years of experience are required.