New Grad IC Package Layout Engineer

Micron Technology, Inc; Boise (ID); On-site; USD 70,000 - 90,000; Full time

Benefits offered by this job

Medical plan

Dental plan

Vision plan

Paid time off

Paid holidays

Job summary

Micron Technology, Inc is hiring an entry-level IC Package Layout Engineer in Boise, Idaho. You will grow skills in package layout design, verification, and manufacturing processes while contributing to memory and storage products.

You will work with experienced engineers, performing layout reviews, documentation, and using AI-enabled tools to improve productivity and quality. Graduation within the last year or upcoming is expected.

Qualifications

• Strong analytical and problem-solving skills.
• Strong verbal and written communication skills.
• Ability to work effectively in a collaborative, cross-functional environment.
• Graduation within last 12 months or before start date.

Responsibilities

• Develop IC package layouts for DDR, LPDDR, GDDR, NAND, and ASIC.
• Support feasibility studies and mechanical substrate layouts.
• Create and maintain PCB and IC package libraries and footprints.
• Perform DRC and use validation tools to ensure design quality.

Skills

Analytical skills

Team collaboration

Verbal and written communication

Problem solving

Education

Bachelor's or Master's in Electrical/Computer/Mechanical Engineering

Tools

CAD/EDA tools

Job description

Micron Technology, Inc is hiring an entry-level IC Package Layout Engineer in Boise, Idaho. You will grow skills in package layout design, verification, and manufacturing processes while contributing to memory and storage products.

You will work with experienced engineers, performing layout reviews, documentation, and using AI-enabled tools to improve productivity and quality. Graduation within the last year or upcoming is expected.