Principal Engineer: Advanced Packaging Innovation

Micron Technology, Inc.; Boise (ID); On-site; USD 150,000 - 230,000; Full time

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Principal Engineer to lead packaging technology roadmaps and investment priorities, applying deep technical and cost-analytic insight to guide well-balanced trade-offs in performance, scalability and total cost of ownership.

Based at the Boise campus, you will shape strategy and drive innovative solutions across packaging platforms. You will collaborate with global R&D, suppliers and manufacturing teams to influence senior management decisions,

Qualifications

• Over 10 years of professional experience in semiconductor advanced packaging.
• Deep knowledge of High Bandwidth Memory, 2.5D integration, and emerging 3D integration strategies including Hybrid bonding.
• Hands-on process module engineering experience in Wafer Level Packaging or 3D stacking process.
• Experience in DRAM manufacturing and OSAT companies.

Responsibilities

• Deliver high-value, differentiated technology solutions by finding opportunities and driving technical innovation to provide business value.
• Collaborate continuously with internal and external partners to ensure seamless technology integration.
• Consult and influence technical and strategic decisions at senior management levels.
• Analyze and understand competitive trends to improve Micron's competitive edge.
• Guide the development of packaging technology roadmaps.
• Assess competitive metrics through data intelligence for strategic advantage.
• Define requirements with proven technical data and content.
• Innovate continuously through patents, trade secrets, technical presentations, and papers, leading to build wins and quality improvements.

Skills

HBM

2.5D integration

3D integration (hybrid bonding)

Wafer Level Packaging

DRAM manufacturing experience

Education

BS/MS/PhD in materials/engineering/physics or related

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Principal Engineer to lead packaging technology roadmaps and investment priorities, applying deep technical and cost-analytic insight to guide well-balanced trade-offs in performance, scalability and total cost of ownership.

Based at the Boise campus, you will shape strategy and drive innovative solutions across packaging platforms. You will collaborate with global R&D, suppliers and manufacturing teams to influence senior management decisions,