Senior Package Modeling Engineer — FEA for 3D Packaging

Thomas To; Santa Clara (CA); On-site; USD 124,000 - 224,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

Join NVIDIA's Advanced Technology Group as a Senior Package Modeling Engineer. You will perform FEA to evaluate stress, warpage, and thermo-mechanical behavior in cutting‑edge semiconductor packages, influencing materials and process options.

You will mentor team members and collaborate across functions to ensure robust package builds and reliable performance. This role offers competitive base salary ranges for Level 3 and Level 4, plus equity and benefits, with base location in Santa Clara, CA.

Qualifications

• MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
• 5+ years of FEA modeling/simulation experience.
• Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
• Knowledge of thermal-mechanical interactions and reliability failure modes.
• Familiarity with JEDEC reliability standards and accelerated life testing.
• Understanding of advanced semiconductor packaging architecture and materials.
• Excellent problem-solving, analytical, and communication skills.

Responsibilities

• Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior.
• Contribute to packaging technology direction and roadmaps by evaluating materials and interconnect concepts.
• Analyze material properties and their impact on package reliability.
• Establish modeling approaches, interpret results, and mentor across teams.
• Collaborate with cross-functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.

Skills

FEA modeling

Thermal-mechanical analysis

Problem solving

Analytical skills

Communication skills

Education

MS or PhD in Mechanical Engineering or Materials Science

Tools

ANSYS

Abaqus

COMSOL

Job description

Join NVIDIA's Advanced Technology Group as a Senior Package Modeling Engineer. You will perform FEA to evaluate stress, warpage, and thermo-mechanical behavior in cutting‑edge semiconductor packages, influencing materials and process options.

You will mentor team members and collaborate across functions to ensure robust package builds and reliable performance. This role offers competitive base salary ranges for Level 3 and Level 4, plus equity and benefits, with base location in Santa Clara, CA.