Senior IC Packaging Development Engineer

Nvidia Corporation; Santa Clara (CA); On-site; USD 168,000 - 345,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA is seeking an experienced Engineer to lead rapid IC packaging development for FA and NPI in Santa Clara, CA. You will drive R&D with internal and external partners, and establish advanced packaging processes to meet turnaround, reliability, and chip-package interaction goals.

The role requires 12+ years in IC packaging, deep knowledge of flip-chip, 2.5D/3D packaging, and familiarity with EDA tools like Cadence Allegro and FEM software (ANSYS/ABAQUS). Equity and benefits are included.

Qualifications

• B.S./M.S./Ph.D. in materials/mechanical/electrical engineering or related semiconductor field.
• 12+ years of hands-on IC packaging development and/or NPI experience.
• Deep understanding of flip-chip, 2.5D/3D packaging, wire bonding.
• Familiarity with IC package EDA tools and FEM software such as ANSYS/ABAQUS.

Responsibilities

• Lead development and rapid prototyping of IC packages for FA and NPI.
• Characterize materials; evaluate molding compounds, substrates, adhesives.
• Coordinate failure analysis on prototype builds to identify root causes.
• Collaborate with foundries, OSAT partners, and design teams to implement processes.

Skills

Flip-chip packaging

2.5D/3D packaging

Wire bonding

Advanced substrates

Education

B.S./M.S./Ph.D. in Materials Science or related semiconductor field

Tools

Cadence Allegro Package Designer

ANSYS

ABAQUS

Job description

We are looking for an experienced Engineer who will lead the development of rapid IC packaging of individual die, to enable Failure Analysis and NPI tasks ahead of high-volume manufacturing. This will include planning & driving related R&D with multiple internal and external partners and you will be responsible for establishing advanced packaging processes needed to meet our NPI goals regarding packaging turn‑around‑time, reliability, and chip‑package interaction. Prior knowledge of Package related Failure Analysis is beneficial.

What you will be doing:

• Package Development & Prototyping: Drive the process, mechanical, thermal, and material evaluation of the latest IC packages. Manage rapid prototyping builds, package stack‑ups, and assembly processes to bring new packaging architectures from concept to small volume for FA and NPI use cases.
• Material Characterization: Pioneer new packaging & die‑level processing methodologies and evaluate innovative packaging materials (e.g., molding compounds, substrates, adhesives).
• Failure Analysis & Debug: Coordinate comprehensive physical and electrical failure analysis on prototype builds, reliability‑tested components to determine root causes of failures.
• Multi‑functional Collaboration: You'll be embedded into the IC Failure Analysis team and collaborate with IC & Package design teams, process & product engineering. Collaborate with foundries and OSAT (Outsourced Semiconductor Assembly and Test) partners to develop & test the required processes, tooling, and workflows.

What we need to see:

• B.S., M.S., or Ph.D, or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
• Packaging Expertise: Deep understanding of flip‑chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
• Experience: 12 + years of hands‑on experience in IC packaging development and/or package design, NPI (New Product Introduction).
• Design & Simulation Tools: Familiarity with IC package EDA software (e.g., Cadence Allegro Package Designer) and Finite Element Modeling (FEM) tools like ANSYS or ABAQUS is a strong plus.
• FA Tooling Proficiency: At a minimum, you'll need basic understanding of advanced packaging related FA techniques and equipment, such as SEM, EDX, CSAM, X‑Ray, and LIT.

Compensation includes a base salary range of 168,000 USD - 270,250 USD for Level 5 and 216,000 USD - 345,000 USD for Level 6, depending on location, experience, and comparable positions. You will also be eligible for equity and benefits.

Applications will be accepted until July 19, 2026.

NVIDIA uses AI tools in its recruiting processes.

NVIDIA is committed to fostering an inclusive work environment and proud to be an equal opportunity employer. As we highly value diversity in our current and future employees, we do not discriminate (including in our hiring and promotion practices) on the basis of race, religion, color, national origin, gender, gender expression, sexual orientation, age, marital status, veteran status, disability status or any other characteristic protected by law.