Senior FEA Engineer: AI-Driven Semiconductor Packaging

NVIDIA Corporation; Santa Clara, Northern (CA, KY); Hybrid; USD 124,000 - 224,000; Full time

Job summary

NVIDIA is seeking a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) to advance semiconductor package reliability and performance. You will perform FEA to study stress, warpage, and thermo-mechanical behavior across cutting-edge packaging platforms and contribute to long‑term technology roadmaps.

Ideal candidates have a strong background in mechanical engineering or materials science, 5+ years of FEA experience, and expertise with major FEA tools.

Qualifications

• MS or PhD or equivalent in Mechanical Engineering, Materials Science, or related field.
• 5+ years of FEA modeling/simulation experience.
• Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
• Knowledge of thermal-mechanical interactions and reliability failure modes.
• Familiarity with JEDEC reliability standards and accelerated life testing.
• Understanding of advanced semiconductor packaging architecture and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).
• Excellent problem-solving, analytical, and communication skills.

Responsibilities

• Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
• Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
• Analyze material properties and their impact on package reliability.
• Establish modeling approaches and assumptions, interpret simulation results, and provide practical mentorship that influences package build, material selection, and manufacturing processes.
• Collaborate with cross‑functional teams to ensure robust package builds.
• Document modeling methodologies and present findings to collaborators.

Skills

FEA modeling

Thermal-mechanical analysis

Reliability analysis

Problem-solving

Communication

Education

MS/PhD in Mechanical Engineering or Materials Science

Tools

ANSYS

Abaqus

COMSOL

Job description

NVIDIA is seeking a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) to advance semiconductor package reliability and performance. You will perform FEA to study stress, warpage, and thermo-mechanical behavior across cutting-edge packaging platforms and contribute to long‑term technology roadmaps.

Ideal candidates have a strong background in mechanical engineering or materials science, 5+ years of FEA experience, and expertise with major FEA tools.