Senior Package Layout Engineer — High-Speed GPU Substrates

NVIDIA; United States; Hybrid; USD 108,000 - 184,000; Full time

Job summary

NVIDIA is seeking a Senior Package Layout Engineer to join our layout team. You will collaborate with the Technical Package Lead and design teams to develop IC substrate layouts for NVIDIA products, while planning schedules and addressing costs, manufacturing and electrical design issues.

You will implement high‑speed, high‑density ASIC layouts, develop breakout patterns, optimize pinouts and routing with Cadence APD/SIP tools, and contribute to CAD libraries.

Qualifications

• The candidate holds a BS in Electrical Engineering or equivalent.
• 2+ years experience in PCB Layout of graphics cards, motherboards, line cards or related technology. HDI designs is a plus
• Proven experience in substrate layout of wire bond and flip chip packages preferred
• Solid understanding of high-speed design signal integrity practices

Responsibilities

• Collaborate on high-speed/density ASIC package layouts and routing.
• Develop substrate breakout patterns; optimize pinout for system trade-offs.
• Support package design using Cadence APD or SiP tool suites.
• Create CAD libraries; improve layout productivity

Skills

Cadence APD

PCB Layout

SiP

Constraint Manager

Virtuoso

Calibre

Valor

HDI designs

Education

B.S. Electrical Engineering

Tools

Cadence APD

Virtuoso

Calibre

Valor

SiP tooling

PCB design tooling

Job description

NVIDIA is seeking a Senior Package Layout Engineer to join our layout team. You will collaborate with the Technical Package Lead and design teams to develop IC substrate layouts for NVIDIA products, while planning schedules and addressing costs, manufacturing and electrical design issues.

You will implement high‑speed, high‑density ASIC layouts, develop breakout patterns, optimize pinouts and routing with Cadence APD/SIP tools, and contribute to CAD libraries.