Senior Package Layout Engineer – Hybrid with Equity Options

NVIDIA Corporation

Santa Clara (CA)

Hybrid

USD 136,000 - 259,000

Full time

14 days+

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Job summary

NVIDIA Corporation in Santa Clara, California seeks a Senior Package Layout Engineer to contribute to high-speed, high-density IC substrate layouts for NVIDIA products. You will collaborate with the Technical Package Lead and design teams to plan schedules, optimize pinouts, routing, stack-up, power distribution, and trade-offs using Cadence APD/SIP tools.

BS in Electrical Engineering and 5+ years PCB layout for GPUs or similar; wire-bond/flip-chip substrate experience and signal integrity

Qualifications

BS in Electrical Engineering required.
5+ years PCB layout experience for GPUs or related tech.
Substrate layout of wire-bond and flip-chip packages preferred.
Cadence APD or SiP and PCB layout tools experience.
Strong understanding of high-speed design and signal integrity.
Experience with Virtuoso, Calibre, and Valor is a plus.

Responsibilities

Implement high-speed/density ASIC package layouts.
Produce substrate breakout patterns for ASIC packages.
Optimize package pinouts with system-level trade-offs.
Assist in package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tools.
Propose layout design trade-offs to the Technical Package Lead.
Conduct feasibility studies on package design goals (size, cost, performance).
Develop CAD library symbols and databases; improve layout productivity.