Senior Package Layout Engineer Hardware (Hybrid, Equity)

NVIDIA; Santa Clara (CA); Hybrid; USD 108,000 - 184,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA seeks a Senior Package Layout Engineer to join our Layout team and develop high-speed, dense IC substrates for NVIDIA products. You will collaborate with Technical Package Lead and design teams to plan schedules, resolve costs, manufacturing, and electrical design issues, ensuring robust package performance.

The role requires a B.S. in Electrical Engineering and 2+ years of PCB layout experience, Cadence APD/SiP, high-speed signal integrity, and familiarity with Virtuoso/Calibre.

Qualifications

• B.S. Electrical Engineering or equivalent experience.
• 2+ years PCB Layout experience for graphics cards, motherboards, or related tech (HDI a plus).
• Proven experience in substrate layout of wire bond and flip chip packages preferred.
• Strong background with Cadence APD or SiP and/or PCB layout tools including Constraint Manager.
• Solid understanding of high-speed design and signal integrity practices.

Responsibilities

• Collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout with system-level trade-offs.
• Assist package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout trade-offs to Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to meet size, cost and performance goals.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.

Skills

PCB Layout

High-speed design

Signal integrity

Cadence APD

Constraint Manager

HDI designs

Virtuoso

Calibre

Education

B.S. Electrical Engineering

Tools

Cadence APD

SiP tool suite

PCB layout tools

Virtuoso

Calibre

Valor

Constraint Manager

Job description

NVIDIA seeks a Senior Package Layout Engineer to join our Layout team and develop high-speed, dense IC substrates for NVIDIA products. You will collaborate with Technical Package Lead and design teams to plan schedules, resolve costs, manufacturing, and electrical design issues, ensuring robust package performance.

The role requires a B.S. in Electrical Engineering and 2+ years of PCB layout experience, Cadence APD/SiP, high-speed signal integrity, and familiarity with Virtuoso/Calibre.