Senior Package Layout Engineer - Equity in GPU Packaging

NVIDIA

Oregon

On-site

USD 108,000 - 184,000

Full time

33 hours ago

Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA in Oregon is seeking a Senior Package Layout Engineer to contribute to high-speed, high-density ASIC packaging. You will collaborate with the Layout team to implement substrate breakout patterns, optimize pinouts, and support routing, placement, and power distribution using Cadence APD or SiP tool suites.

Required are a B.S. in Electrical Engineering and 2+ years of PCB layout experience on graphics cards or motherboards (HDI a plus).

Qualifications

B.S. Electrical Engineering or equivalent required.
2+ years PCB layout experience on graphics cards, motherboards; HDI is a plus.
Experience with Cadence APD or SiP and PCB layout tools, Constraint Manager preferred.

Responsibilities

Collaborate on high speed/density ASIC package layout.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout with system-level trade-offs.
Support routing, placement, stack-up, reference plane and power distribution using Cadence tools.
Propose layout trade-offs to lead for resolution and implementation.
Conduct feasibility studies for size, cost, and performance goals.
Develop CAD library databases using Cadence APD.
Improve layout productivity with new methodologies.