Senior Package Layout Engineer - Hardware (Hybrid, Equity)

NVIDIA Corporation; United States; Hybrid; USD 136,000 - 259,000; Full time

Benefits offered by this job

Equity

Benefits

Job summary

NVIDIA Corporation in the United States is seeking a Senior Package Layout Engineer to contribute to the detailed layout of IC substrates for NVIDIA products. You will collaborate with the technical lead and design teams to plan schedules and resolve manufacturing and electrical design issues.

The role requires 5+ years in PCB layout for graphics cards and related tech, with Cadence APD/SIP experience and strong signal integrity knowledge. Hybrid work model and equity/benefits are included.

Qualifications

• B.S. Electrical Engineering degree or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or related tech.
• Experience with HDI designs is a plus.
• Background in substrate layout of wire bond and flip chip packages preferred.
• Cadence APD or SiP and PCB layout tools experience.

Responsibilities

• Collaborate to implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools
• Develop methodologies to improve layout productivity.

Skills

High-speed design

Signal integrity

Cadence APD

PCB layout tools

Education

B.S. Electrical Engineering

Tools

Cadence APD/SIP

Virtuoso

Calibre

Valor

Job description

NVIDIA Corporation in the United States is seeking a Senior Package Layout Engineer to contribute to the detailed layout of IC substrates for NVIDIA products. You will collaborate with the technical lead and design teams to plan schedules and resolve manufacturing and electrical design issues.

The role requires 5+ years in PCB layout for graphics cards and related tech, with Cadence APD/SIP experience and strong signal integrity knowledge. Hybrid work model and equity/benefits are included.