Principal Engineer, Advanced Packaging Innovation

Micron Memory Malaysia Sdn Bhd; Boise (ID); On-site; USD 120,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Robust paid time-off program

Paid family leave

Job summary

A leading memory storage solutions company is seeking a Principal Engineer for its Advanced Package Technology Development team in Boise. This role involves defining technical requirements, guiding technology roadmaps, and contributing to innovation through patents and presentations. Candidates should have over 5 years of experience in semiconductor advanced packaging and a relevant degree. The position offers opportunities for significant impact on technology solutions and corporate success.

Qualifications

• Over 5 years of professional experience in semiconductor advanced packaging.
• Experience in DRAM manufacturing and OSAT companies.
• Proficient in English, with additional language skills in East Asian languages preferred.

Responsibilities

• Define requirements with proven technical data and content.
• Consult and influence technical decisions at senior management levels.
• Guide the development of packaging technology roadmaps.

Skills

Deep knowledge of High Bandwidth Memory

2.5D integration

3D integration strategies

Hybrid bonding

Hands-on process module engineering

DRAM manufacturing experience

Education

BS, MS, or Ph.D. in Material Science, Electrical, Chemical, Mechanical Engineering, Physics, or related field

Job description

A leading memory storage solutions company is seeking a Principal Engineer for its Advanced Package Technology Development team in Boise. This role involves defining technical requirements, guiding technology roadmaps, and contributing to innovation through patents and presentations. Candidates should have over 5 years of experience in semiconductor advanced packaging and a relevant degree. The position offers opportunities for significant impact on technology solutions and corporate success.